B81B 2201/0228
Inertial sensors
B81B2201/0228 (Inertial sensors) appears on 1,785 US grants and 2,062 published applications in this corpus.
Search patents in B81B- Granted patents
- 1,785
- Published applications
- 2,062
- Assignees
- 423
- Inventors
- 2,628
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 7 | 0 |
| 1996 | 10 | 0 |
| 1997 | 9 | 0 |
| 1998 | 12 | 0 |
| 1999 | 11 | 0 |
| 2000 | 11 | 0 |
| 2001 | 24 | 12 |
| 2002 | 21 | 29 |
| 2003 | 21 | 21 |
| 2004 | 31 | 45 |
| 2005 | 40 | 46 |
| 2006 | 32 | 47 |
| 2007 | 33 | 40 |
| 2008 | 34 | 34 |
| 2009 | 21 | 59 |
| 2010 | 29 | 58 |
| 2011 | 39 | 62 |
| 2012 | 56 | 68 |
| 2013 | 66 | 79 |
| 2014 | 70 | 95 |
| 2015 | 78 | 131 |
| 2016 | 115 | 138 |
| 2017 | 145 | 160 |
| 2018 | 111 | 140 |
| 2019 | 127 | 139 |
| 2020 | 118 | 114 |
| 2021 | 109 | 108 |
| 2022 | 94 | 113 |
| 2023 | 107 | 85 |
| 2024 | 63 | 104 |
| 2025 | 66 | 78 |
| 2026 | 62 | 57 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- MEMS device6 Oct 2026US 12,753,069 B2Rohm Co., Ltd.
- Circuit for operating a capacitive sensor and sensor apparatus6 Oct 2026US 12,754,221 B2Robert Bosch GmbH
- Device, system, method, and computer product for detecting and evaluating environmental quantities and events with modular approach and variable complexity6 Oct 2026US 12,754,529 B2STMicroelectronics S,r.l.
- Microelectromechanical acceleration sensor29 Sep 2026US 12,748,127 B2Robert Bosch GmbH
- Microelectromechanical systems package with a lateral vent hole connected to a cavity and method for manufacturing the same22 Sep 2026US 12,741,863 B2Vanguard International Semiconductor Corporation
- Microelectromechanical device with recovery from stiction conditions1 Oct 2026US 2026/0296874 A1STMicroelectronics International N. V.
- Anchor structure1 Oct 2026US 2026/0296876 A1Lawrence Semiconductor Research Laboratory, Inc.
- Micro-electro-mechanical system package and fabrication method thereof1 Oct 2026US 2026/0296879 A1Vanguard International Semiconductor Corporation
- Integrated device and manufacturing method thereof24 Sep 2026US 2026/0285673 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device17 Sep 2026US 2026/0274648 A1Infineon Technologies AG
Most cited
By later US patents
- Microelectromechanical device having a stiffened support beam, and methods of forming stiffened support beams in MEMS294US 6,632,698 B2Hewlett-Packard Development Company, L. P. · 2003
- MEMS and CMOS integration with low-temperature bonding243US 9,394,161 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- CMOS-MEMS device structure, bonding mesa structure and associated method235US 9,656,852 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Method of making a digital flexure beam accelerometer216US 5,192,395 ATexas Instruments Incorporated · 1993
- Microelectromechanical accelerometer for automotive applications205US 6,199,874 B1Cornell Research Foundation, Inc. · 2001