H10W 80/041
Thermally treating
Official title: {Thermally treating}
H10W80/041 (Thermally treating) appears on 93 US grants and 117 published applications in this corpus.
Search patents in H10W- Granted patents
- 93
- Published applications
- 117
- Assignees
- 31
- Inventors
- 171
- Latest grant
- 17 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2013 | 0 | 1 |
| 2014 | 2 | 3 |
| 2015 | 0 | 2 |
| 2016 | 3 | 2 |
| 2017 | 1 | 2 |
| 2018 | 2 | 3 |
| 2019 | 2 | 0 |
| 2020 | 5 | 12 |
| 2021 | 10 | 29 |
| 2022 | 22 | 18 |
| 2023 | 15 | 11 |
| 2024 | 17 | 12 |
| 2025 | 10 | 13 |
| 2026 | 4 | 9 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package and method of manufacturing the same17 Mar 2026US 12,581,931 B2Samsung Electronics Co., Ltd.
- Method for manufacturing semiconductor package10 Feb 2026US 12,550,654 B2Advanced Semiconductor Engineering, Inc.
- Manufacturing method of semiconductor device3 Feb 2026US 12,543,602 B2SK hynix Inc.
- Memory packages and methods of forming same27 Jan 2026US 12,538,851 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same30 Sep 2025US 12,431,468 B2Yangtze Memory Technologies Co., Ltd.
- Method for manufacturing semiconductor device24 Sep 2026US 2026/0293757 A1Resonac Corporation
- Semiconductor package and method of manufacturing the same2 Jul 2026US 2026/0190968 A1Samsung Electronics Co., Ltd.
- Metallurgy structure for hybrid bonding11 Jun 2026US 2026/0165112 A1International Business Machines Corporation
- Manufacturing method of semiconductor device14 May 2026US 2026/0137009 A1SK hynix Inc.
- Memory packages and methods of forming same7 May 2026US 2026/0130288 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Distortion-compensated wafer bonding method and apparatus using a temperature-controlled backside thermal expansion layer19US 10,790,296 B1SanDisk Technologies LLC · 2020
- Packaged semiconductor devices including backside power rails and methods of forming the same15US 11,239,208 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2022
- Bonded assembly containing oxidation barriers and/or adhesion enhancers and methods of forming the same14US 11,139,272 B2SanDisk Technologies LLC · 2021
- Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same13US 11,562,985 B2Yangtze Memory Technologies Co., Ltd. · 2023
- Integration of three-dimensional NAND memory devices with multiple functional chips12US 11,031,377 B2Yangtze Memory Technologies Co., Ltd. · 2021