Memory packages and methods of forming same

A package comprising:

• a logic device;
• a memory stack attached to the logic device, wherein the memory stack comprises:
• a first redistribution structure, a first side of the first redistribution structure coupled to the logic device;
• one or more first memory structures coupled to a second side of the first redistribution structure, wherein each of the one or more first memory structures comprises a first memory die and a first peripheral circuitry die directly coupled to the first memory die;
• a first encapsulant over the first redistribution structure and along sidewalls of the one or more first memory structures;
• a second redistribution structure over the first encapsulant;
• and
• a first conductive pillar in the first encapsulant, the first conductive pillar electrically coupling the first redistribution structure and the second redistribution structure.

A package comprising:

• a logic die;
• a first redistribution structure bonded to the logic die;
• a first set of memory structures on and electrically coupled to the first redistribution structure, wherein each memory structure of the first set of memory structures comprises a first peripheral circuitry die and a first memory die, wherein the first peripheral circuitry die controls the first memory die;
• a first encapsulant on the first redistribution structure, the first encapsulant extending along sidewalls of the first set of memory structures;
• a first through via extending through the first encapsulant;
• a second redistribution structure, the first through via electrically coupling a first conductive feature of the first redistribution structure to a second conductive feature of the second redistribution structure, wherein the first set of memory structures is between the first redistribution structure and the second redistribution structure;
• a second set of memory structures on and electrically coupled to the second redistribution structure;
• and
• a second encapsulant on the second redistribution structure, the second encapsulant extending along sidewalls of the second set of memory structures, wherein the second redistribution structure is between the first encapsulant and the second encapsulant.