H10W 72/9528
Intermetallic compounds
Official title: {Intermetallic compounds}
H10W72/9528 (Intermetallic compounds) appears on 28 US grants and 37 published applications in this corpus.
Search patents in H10W- Granted patents
- 28
- Published applications
- 37
- Assignees
- 23
- Inventors
- 88
- Latest grant
- 9 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 1 | 0 |
| 2012 | 1 | 1 |
| 2013 | 0 | 4 |
| 2014 | 1 | 0 |
| 2015 | 1 | 2 |
| 2016 | 1 | 0 |
| 2017 | 1 | 4 |
| 2018 | 4 | 3 |
| 2019 | 4 | 3 |
| 2020 | 0 | 3 |
| 2021 | 1 | 1 |
| 2022 | 4 | 2 |
| 2023 | 2 | 7 |
| 2024 | 1 | 2 |
| 2025 | 6 | 3 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Package structures and methods of manufacturing the same9 Dec 2025US 12,494,446 B2Advanced Semiconductor Engineering, Inc.
- Bonded assembly including interconnect-level bonding pads and methods of forming the same21 Oct 2025US 12,451,451 B2SanDisk Technologies LLC
- Bonded assembly including interconnect-level bonding pads and methods of forming the same1 Jul 2025US 12,347,804 B2SanDisk Technologies LLC
- Electronic device with multi-layer contact and system18 Mar 2025US 12,255,168 B2Infineon Technologies AG
- Semiconductor structure and manufacturing method thereof28 Jan 2025US 12,211,813 B2Changxin Memory Technologies, Inc.
- Package structure18 Jun 2026US 2026/0173945 A1Advanced Semiconductor Engineering, Inc.
- Metallization structure having an outer metallization layer comprising nickel and platinum layers to reduce inter-metal compound formation31 Jul 2025US 2025/0246568 A1RF360 Singapore Pte. Ltd.
- Semiconductor package1 May 2025US 2025/0140720 A1Samsung Electronics Co., Ltd.
- Nanowire bonding interconnect for fine-pitch microelectronics20 Mar 2025US 2025/0096168 A1Adeia Semiconductor Technologies LLC
- Electronic device with multi-layer contact and system14 Mar 2024US 2024/0088087 A1Infineon Technologies AG
Most cited
By later US patents
- Nanowire bonding interconnect for fine-pitch microelectronics61US 11,387,202 B2Invensas Corporation · 2022
- Interconnect structures and methods for fabricating interconnect structures19US 10,121,754 B2Massachusetts Institute of Technology · 2018
- Shielded through via structures and methods for fabricating shielded through via structures14US 10,199,553 B1Massachusetts Institute of Technology · 2019
- Interconnect structure and semiconductor structures for assembly of cryogenic electronic packages13US 10,242,968 B2Massachusetts Institute of Technology · 2019
- Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits13US 10,396,269 B2Massachusetts Institute of Technology · 2019