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US 12,494,446 B2Granted
Package structures and methods of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsAn-Hsuan Hsu, Chin-Li Kao
Life of this patent
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Abstract
A package structure is disclosed. The package structure includes a substrate including a conductive element and a plurality of wires having a surface area through which heat of the conductive element can be dissipated, lowering a bonding temperature of the conductive element. The package structure also includes a conductive layer disposed between the conductive element of the substrate and the plurality of wires. The conductive contact layer attaches the plurality of wires over the conductive element.
Claims19
A package structure, comprising:
- a substrate including a conductive element;
- a plurality of wires having a surface area through which heat of the conductive element can be dissipated, lowering a bonding temperature of the conductive element;
- and
- a conductive layer disposed between the conductive element of the substrate and the plurality of wires, wherein the conductive layer attaches the plurality of wires over the conductive element,
- wherein a lateral surface of the conductive layer protrudes from a lateral surface of the conductive element.
2 more elements
A package structure, comprising:
- a first conductive element;
- a first low temperature bonding structure disposed over the first conductive element and connecting the first conductive element with a second conductive element;
- and
- a first conductive inter layer bonding the first conductive element to the first low temperature bonding structure and spaced apart from the second conductive element,
- wherein the first low temperature bonding structure has a non-entangled portion in contact with the first conductive inter layer and an entangled portion outside of the first conductive inter layer.
2 more elements
Dependencies are inferred from the claim text.