US 10,199,553 B1Granted

Shielded through via structures and methods for fabricating shielded through via structures

AssigneeMassachusetts Institute of Technology

InventorsWilliam D. Oliver, Andrew J. Kerman, Rabindra N. Das, Donna-Ruth W. Yost, Danna Rosenberg, Mark A. Gouker

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Abstract

Described are concepts, systems, circuits and techniques related to shielded through via structures and methods for fabricating such shielded through via structures. The described shielded through via structures and techniques allow for assembly of multi-layer semiconductor structures including one or more superconducting semiconductor structures (or integrated circuits).

Claims10

Dependent claims

A shielded through via based electronic package, comprising:

a superconducting integrated circuit having first and second opposing surfaces, each of the first and second opposing surfaces having a first circuit including a plurality of electrical conductors disposed thereon;
a superconducting and/or a partially superconducting circuitized substrate having first and second opposing surfaces, each of the first and second opposing surfaces having a second circuit including a plurality of electrical conductors disposed thereon;
and
an interposer having first and second opposing surfaces with each surface including a plurality of electrical conductors disposed thereon, the interposer disposed substantially between said superconducting integrated circuit and said superconducting and/or partially superconducting circuitized substrate, said second surface of said interposer electrically interconnecting said first circuit of said superconducting integrated circuit and said first surface of said interposer electrically interconnecting said second circuit of said superconducting and/or partially superconducting circuitized substrate using a superconducting and/or a partial superconducting interconnect, and electrically interconnecting select ones of the electrical conductors of the first circuit with corresponding select ones of the electrical conductors of the second circuit, said interposer including at least one through shielded via having first and second opposing surfaces electrically interconnecting corresponding first and second opposing surfaces of the interposer, the at least one through shielded via coated with, filled with, or partially filled with a high quality factor material composition and electrically coupled to the select ones of the electrical conductors of the first circuit and to the select electrical conductors of the second circuit by said interposer to yield an electrical interconnect that goes from second circuit-first interposer-first shielded via-second shielded via-second interposer-first circuit interconnect.

1 more element

Dependencies are inferred from the claim text.

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Abstract

A shielded through via based electronic package, comprising:

a superconducting integrated circuit having first and second opposing surfaces, each of the first and second opposing surfaces having a first circuit including a plurality of electrical conductors disposed thereon;
a superconducting and/or a partially superconducting circuitized substrate having first and second opposing surfaces, each of the first and second opposing surfaces having a second circuit including a plurality of electrical conductors disposed thereon;
and
an interposer having first and second opposing surfaces with each surface including a plurality of electrical conductors disposed thereon, the interposer disposed substantially between said superconducting integrated circuit and said superconducting and/or partially superconducting circuitized substrate, said second surface of said interposer electrically interconnecting said first circuit of said superconducting integrated circuit and said first surface of said interposer electrically interconnecting said second circuit of said superconducting and/or partially superconducting circuitized substrate using a superconducting and/or a partial superconducting interconnect, and electrically interconnecting select ones of the electrical conductors of the first circuit with corresponding select ones of the electrical conductors of the second circuit, said interposer including at least one through shielded via having first and second opposing surfaces electrically interconnecting corresponding first and second opposing surfaces of the interposer, the at least one through shielded via coated with, filled with, or partially filled with a high quality factor material composition and electrically coupled to the select ones of the electrical conductors of the first circuit and to the select electrical conductors of the second circuit by said interposer to yield an electrical interconnect that goes from second circuit-first interposer-first shielded via-second shielded via-second interposer-first circuit interconnect.

1 more element