H10W 72/9223
With redistribution layers [rdl]
Official title: {with redistribution layers [RDL]}
H10W72/9223 (With redistribution layers [rdl]) appears on 1,450 US grants and 1,707 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,450
- Published applications
- 1,707
- Assignees
- 319
- Inventors
- 2,351
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 6 | 0 |
| 2001 | 9 | 9 |
| 2002 | 21 | 29 |
| 2003 | 27 | 57 |
| 2004 | 25 | 57 |
| 2005 | 48 | 88 |
| 2006 | 46 | 71 |
| 2007 | 58 | 79 |
| 2008 | 52 | 86 |
| 2009 | 53 | 55 |
| 2010 | 62 | 69 |
| 2011 | 48 | 49 |
| 2012 | 66 | 73 |
| 2013 | 64 | 80 |
| 2014 | 81 | 75 |
| 2015 | 65 | 86 |
| 2016 | 87 | 87 |
| 2017 | 93 | 97 |
| 2018 | 89 | 80 |
| 2019 | 76 | 89 |
| 2020 | 90 | 102 |
| 2021 | 57 | 74 |
| 2022 | 59 | 58 |
| 2023 | 51 | 46 |
| 2024 | 50 | 52 |
| 2025 | 39 | 45 |
| 2026 | 26 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wafer-level hybrid bonded RF switch with redistribution layer6 Oct 2026US 12,757,792 B2Qorvo US, Inc.
- Photosensitive resin composition, photosensitive sheet, cured film, method for producing cured film, electronic component, antenna element, semiconductor package, and display device1 Sep 2026US 12,724,345 B2Toray Industries, Inc.
- Semiconductor package and method of manufacturing the same25 Aug 2026US 12,721,242 B2Samsung Electronics Co., Ltd.
- Semiconductor device11 Aug 2026US 12,707,942 B2Samsung Electronics Co., Ltd.
- Structures and methods for reducing thermal expansion mismatch during integrated circuit packaging11 Aug 2026US 12,707,976 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Display device and method of manufacturing the same1 Oct 2026US 2026/0301629 A1Samsung Display Co., Ltd.
- Semiconductor element and semiconductor device24 Sep 2026US 2026/0293737 A1Rohm Co., Ltd.
- Metal oxide layered structure and methods of forming the same10 Sep 2026US 2026/0271682 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and method of manufacturing the same20 Aug 2026US 2026/0248019 A1Ablic Inc.
- Semiconductor devices and methods of manufacturing semiconductor devices13 Aug 2026US 2026/0240033 A1Amkor Technology Singapore Holding Pte.Ltd.
Most cited
By later US patents
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Packaging methods and structures using a die attach film854US 9,064,879 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Method and apparatus for generating a device ID for stacked devices631US 7,111,149 B2Intel Corporation · 2006
- Interconnect structure for wafer level package596US 8,829,676 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Chip stack package and manufacturing method thereof368US 7,276,799 B2Samsung Electronics Co., Ltd. · 2007