Semiconductor element and semiconductor device

Abstract

A semiconductor element includes a main body, an electrode, a redistribution wiring, a first protective film, and a first intermediate layer. The electrode is located on one side of the main body in a first direction. The redistribution wiring is located opposite the main body with respect to the electrode. The first protective film is located on the same side as the redistribution wiring with respect to the electrode. The first protective film overlaps with the redistribution wiring as viewed in the first direction. The first intermediate layer includes a first portion located between the redistribution wiring and the first protective film. The first portion is in contact with the first protective film. The first intermediate layer is an insulator and contains an inorganic compound. The adhesion strength of the first protective film to the first intermediate layer is higher than the adhesion strength of the first protective film to the redistribution wiring.

Dependencies are inferred from the claim text.