Semiconductor package and method of manufacturing the same

A method of manufacturing a semiconductor package, comprising:

• forming a plurality of insulating layers including, an uppermost insulating layer;
• forming a plurality of redistribution wirings in the plurality of insulating layers, wherein the plurality of redistribution wirings includes an uppermost redistribution wiring, and the uppermost redistribution wiring includes a redistribution via and a redistribution line on the redistribution via;
• forming a bonding pad on the redistribution line, wherein the uppermost insulating layer overlaps the redistribution line and a first portion of the bonding pad;
• forming an opening in the uppermost insulating layer that exposes a second portion of the bonding pad from the uppermost insulating layer;
• and
• forming a molding member on the plurality of insulating layers, wherein the molding member is in contact with a side surface of the bonding pad.

A semiconductor package, comprising:

• a first redistribution wiring layer having a first surface and a second surface opposite to the first surface;
• a conductive bump on the first surface;
• a first semiconductor device on the conductive bump;
• a molding member on the first redistribution wiring layer, wherein the molding member is on the first semiconductor device;
• a conductive structure that penetrates the molding member and does not overlap the first semiconductor device in a direction perpendicular to the first semiconductor device;
• a second redistribution wiring layer on the molding member and electrically connected to the first redistribution wiring layer through the conductive structure;
• and
• a second semiconductor device on the second redistribution wiring layer,
• wherein the first redistribution wiring layer comprises:
• a plurality of redistribution wirings electrically connecting the first and second semiconductor devices and having an uppermost redistribution wiring, the uppermost redistribution wiring having a redistribution via and a redistribution line on the redistribution via;
• a bonding pad on the redistribution line, wherein the conductive bump is on the bonding pad;
• and
• an uppermost insulating layer that overlaps the uppermost redistribution wiring and has an opening that exposes a portion of the bonding pad from the uppermost insulating layer.