Semiconductor device and method of manufacturing the same
AssigneeAblic Inc.
InventorTetsuya SAKUMA
Life of this patent
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Abstract
Provided is a semiconductor device capable of suppressing occurrence of cracks in an insulating film in a layer below a pad opening portion even in the semiconductor device including two layers of metal films. The semiconductor device includes: a first wiring layer formed on a surface of a semiconductor substrate; an insulating film formed in a layer above the first wiring layer, the insulating film including a thick film portion and a thin film portion; a metal film formed in a layer above the insulating film; a protective film formed in a layer above the metal film; and a pad opening portion formed in the protective film such that a portion of the metal film is exposed, the pad opening portion being formed at a position overlapping the thick film portion in plan view.
Claims20
A semiconductor device, comprising:
- a first wiring layer formed on a surface of a semiconductor substrate;
- an insulating film formed in a layer above the first wiring layer, the insulating film including a thick film portion and a thin film portion;
- a metal film formed in a layer above the insulating film;
- a protective film formed in a layer above the metal film;
- and
- a pad opening portion formed in the protective film such that a portion of the metal film is exposed, the pad opening portion being formed at a position overlapping the thick film portion in plan view.
A method of manufacturing a semiconductor device, the method comprising:
- forming a first wiring layer on a surface of a semiconductor substrate;
- forming an insulating film in a layer above the first wiring layer, forming a photoresist film in a layer above the insulating film, and forming a thick film portion and a thin film portion by etching the insulating film with the photoresist film being used as a mask;
- forming a metal film in a layer above the insulating film;
- forming a protective film in a layer above the metal film;
- and
- forming a pad opening portion in the protective film at a position overlapping the thick film portion in plan view such that a portion of the metal film is exposed.
Dependencies are inferred from the claim text.