H10W 72/647
Dispositions of multiple strap connectors
Official title: {Dispositions of multiple strap connectors}
H10W72/647 (Dispositions of multiple strap connectors) appears on 190 US grants and 237 published applications in this corpus.
Search patents in H10W- Granted patents
- 190
- Published applications
- 237
- Assignees
- 83
- Inventors
- 436
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2007 | 0 | 2 |
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
| 2011 | 1 | 3 |
| 2012 | 0 | 4 |
| 2013 | 3 | 7 |
| 2014 | 4 | 10 |
| 2015 | 10 | 20 |
| 2016 | 19 | 18 |
| 2017 | 20 | 21 |
| 2018 | 18 | 18 |
| 2019 | 9 | 14 |
| 2020 | 19 | 26 |
| 2021 | 21 | 26 |
| 2022 | 17 | 14 |
| 2023 | 11 | 16 |
| 2024 | 12 | 18 |
| 2025 | 16 | 9 |
| 2026 | 9 | 10 |
By publication year. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for manufacturing semiconductor apparatus and semiconductor apparatus8 Sep 2026US 12,733,511 B2Rohm Co., Ltd.
- Electrical circuit body, power converter, and electrical circuit body manufacturing method4 Aug 2026US 12,702,049 B2Hitachi Astemo, Ltd.
- Isolated metal clips with structural bridge14 Jul 2026US 12,685,193 B2Analog Devices, Inc.
- Clip interconnect with micro contact heads2 Jun 2026US 12,648,455 B2Semiconductor Components Industries, LLC
- Semiconductor device19 May 2026US 12,635,573 B2Rohm Co., Ltd.
- Isolated metal clips with structural bridge8 Oct 2026US 2026/0314452 A1Analog Devices, Inc.
- Frame module for a semiconductor integrated circuit, ic, as well as a power module comprising such a frame module and a method of manufacturing such a frame module10 Sep 2026US 2026/0271778 A1Nexperia B. V.
- Semiconductor device3 Sep 2026US 2026/0262546 A1Rohm Co., Ltd.
- Semiconductor package2 Jul 2026US 2026/0191009 A1Samsung Electronics Co., Ltd.
- Transistor Chip Package with Internal Clip Interconnect19 Mar 2026US 2026/0082942 A1Infineon Technologies Austria AG
Most cited
By later US patents
- Device including two power semiconductor chips and manufacturing thereof54US 9,331,060 B2Infineon Technologies AG · 2016
- Flip chip assembly and process with sintering material on metal bumps41US 9,117,811 B2Tessera, Inc. · 2015
- Method for fabricating stack die package23US 9,589,929 B2Vishay-Siliconix · 2017
- Packaging solutions for devices and systems comprising lateral GaN power transistors20US 9,589,868 B2GaN Systems Inc. · 2017
- Device including two power semiconductor chips and manufacturing thereof15US 8,975,711 B2Infineon Technologies AG · 2015