H10W 72/6478
Multiple strap connectors connecting to a common bond pad
Official title: {multiple strap connectors connecting to a common bond pad}
H10W72/6478 (Multiple strap connectors connecting to a common bond pad) appears on 32 US grants and 37 published applications in this corpus.
Search patents in H10W- Granted patents
- 32
- Published applications
- 37
- Assignees
- 21
- Inventors
- 67
- Latest grant
- 10 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 2 |
| 2017 | 3 | 6 |
| 2018 | 2 | 2 |
| 2019 | 4 | 3 |
| 2020 | 4 | 5 |
| 2021 | 6 | 7 |
| 2022 | 6 | 3 |
| 2023 | 2 | 4 |
| 2024 | 1 | 1 |
| 2025 | 3 | 0 |
| 2026 | 1 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
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- Universal Surface-Mount Semiconductor Package12 Mar 2026US 2026/0076242 A1Adventive International Ltd.
- Power Half-Bridge Module, Power Inverter, and Method for Producing a Power Half-Bridge Module10 Oct 2024US 2024/0339439 A1Vitesco Technologies Germany GmbH
- Packaged structure, electric power control system, and manufacturing method7 Dec 2023US 2023/0395556 A1
- Semiconductor device27 Jul 2023US 2023/0238312 A1Rohm Co., Ltd.
Most cited
By later US patents
- Universal surface-mount semiconductor package10US 9,576,932 B2Adventive IPBank · 2017
- Semiconductor power package and method of manufacturing the same6US 9,837,288 B2Infineon Technologies Austria AG · 2017
- Method of manufacturing a semiconductor power package5US 10,256,119 B2Infineon Technologies Austria AG · 2019
- Universal surface-mount semiconductor package2US 11,469,205 B2Adventive International Ltd. · 2022
- Universal surface-mount semiconductor package1US 10,032,744 B2Adventive IPBank · 2018