Semiconductor device and vehicle

A semiconductor device comprising:

• a first lead including a base portion;
• a semiconductor element mounted on one side in a thickness direction of the base portion and having a first electrode disposed on the one side in the thickness direction and a second electrode disposed on the other side in the thickness direction;
• a second lead spaced apart from the base portion in a first direction orthogonal to the thickness direction;
• a first conductive member including a first portion bonded to the first electrode and a second portion bonded to the second lead, the first conductive member being electrically connected to the first electrode and the second lead;
• a first bonding layer interposed between the base portion and the second electrode, and bonded to the base portion and the second electrode;
• and
• a second bonding layer interposed between the first electrode and the first portion, and bonded to the first electrode and the first portion,
• wherein the first bonding layer includes a sintered metal.