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US 10,032,744 B2Granted
Universal surface-mount semiconductor package
AssigneeAdventive IPBank
InventorsRichard K. Williams, Keng-Hung Lin
Life of this patent
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Abstract
A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.
Claims13
A semiconductor package comprising:
- a semiconductor die encapsulated in a plastic body;
- and
- at least two metal leads, each of the leads being partially encapsulated in the plastic body and having a foot, each of the feet having a flat bottom surface, wherein the flat bottom surfaces of all of the feet are coplanar, wherein the die is mounted on an exposed die pad, the die pad having an exposed flat bottom surface that is coplanar with the flat bottom surface of each of the feet, at least a portion of each of the feet being thinner than the die pad.
A semiconductor package comprising:
- a die pad at least partially encapsulated in a plastic body, the plastic body having a sidewall;
- a metal lead, the lead protruding through the sidewall to a location outside the plastic body;
- and
- a tie bar extending laterally from the die pad to the sidewall of the plastic body, an exposed end of the tie bar being flush with the sidewall.
1 more element
Dependencies are inferred from the claim text.