Transistor Chip Package with Internal Clip Interconnect

A method of manufacturing a semiconductor package comprising a transistor chip having a first side and a second side opposite the first side, the transistor chip comprises a first load electrode and a second load electrode on the first side;

• a carrier facing the second side of the transistor chip,
• a first terminal post arranged laterally beside the transistor chip;
• a second terminal post arranged laterally beside the transistor chip on an opposite side of the transistor chip, wherein the second terminal post is a part of the carrier or physically connects to the carrier;
• a first clip connecting the first load electrode to the first terminal post;
• a second clip connecting the second load electrode to the second terminal post;
• wherein an upper surface of the first terminal post and an upper surface of the second terminal post are arranged at different levels of height measured from an upper surface of the carrier, and the first clip and the second clip are of same shape, the method comprising:
• providing the first terminal post and providing the second terminal post;
• placing the transistor chip on the carrier;
• placing the first clip to connect between the first load electrode and the first terminal post;
• and
• placing the second clip to connect between the second load electrode and the second terminal post.

A semiconductor package comprising:

• a transistor chip having a first side and a second side opposite the first side, the transistor chip comprises a first load electrode and a second load electrode on the first side;
• a carrier facing the second side of the transistor chip,
• a first terminal post arranged laterally beside the transistor chip;
• a second terminal post arranged laterally beside the transistor chip on an opposite side of the transistor chip, wherein the second terminal post is a part of the carrier or physically connects to the carrier;
• a first clip connecting the first load electrode to the first terminal post;
• a second clip connecting the second load electrode to the second terminal post;
• wherein
• an upper surface of the first terminal post and an upper surface of the second terminal post are arranged at different levels of height measured from an upper surface of the carrier, and wherein
• the first clip comprises a vertical clip portion extending in a vertical direction and a horizontal clip portion extending in a horizontal direction, the horizontal clip portion of the first clip having a first horizontal section and a second horizontal section, the first horizontal section and the second horizontal section are connected by a vertically stepped section.