H10W 72/07354
Changes in dispositions
Official title: {changes in dispositions}
H10W72/07354 (Changes in dispositions) appears on 2,281 US grants and 2,946 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,281
- Published applications
- 2,946
- Assignees
- 480
- Inventors
- 4,365
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 2 |
| 2002 | 2 | 10 |
| 2003 | 3 | 6 |
| 2004 | 4 | 11 |
| 2005 | 9 | 14 |
| 2006 | 15 | 12 |
| 2007 | 8 | 13 |
| 2008 | 8 | 19 |
| 2009 | 10 | 18 |
| 2010 | 14 | 15 |
| 2011 | 17 | 35 |
| 2012 | 15 | 67 |
| 2013 | 48 | 69 |
| 2014 | 68 | 90 |
| 2015 | 97 | 153 |
| 2016 | 123 | 176 |
| 2017 | 151 | 151 |
| 2018 | 147 | 175 |
| 2019 | 165 | 244 |
| 2020 | 208 | 340 |
| 2021 | 216 | 309 |
| 2022 | 245 | 287 |
| 2023 | 207 | 186 |
| 2024 | 201 | 255 |
| 2025 | 182 | 199 |
| 2026 | 106 | 90 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring board, semiconductor device, and method for manufacturing semiconductor device6 Oct 2026US 12,757,762 B2Kioxia Corporation
- Package structure with protective lid6 Oct 2026US 12,757,797 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Systems and methods for active discharge for inverter for electric vehicle22 Sep 2026US 12,745,369 B2BorgWarner US Technologies LLC
- Electronic devices and methods of manufacturing electronic devices22 Sep 2026US 12,745,629 B2Amkor Technology Singapore Holding Pte.Ltd.
- Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly8 Oct 2026US 2026/0314397 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor Device and Method of Making a Semiconductor Package with Graphene for Die Attach1 Oct 2026US 2026/0305028 A1STATS ChipPAC Pte. Ltd.
- Pixel device for led display and led display apparatus having the same1 Oct 2026US 2026/0305469 A1Seoul Viosys Co., Ltd.
- Electronic package and shielding part including semiconductor block and magnetized layer24 Sep 2026US 2026/0293688 A1Siliconware Precision Industries Co., Ltd.
- Semiconductor device and semiconductor memory device24 Sep 2026US 2026/0293761 A1
Most cited
By later US patents
- Mold-type semiconductor device207US 5,218,231 AKabushiki Kaisha Toshiba · 1993
- Magnetic shielding of MRAM package190US 9,875,971 B2Globalfoundries Singapore Pte. Ltd. · 2018
- Method of assembling stacks of integrated circuit dies179US 4,984,358 AMicroelectronics and Computer Technology Corporation · 1991
- Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies177US 9,824,974 B2Invensas Corporation · 2017
- DBI to Si bonding for simplified handle wafer174US 10,964,664 B2Invensas Bonding Technologies, Inc. · 2021