H10W 72/07353
Changes in shapes
Official title: {changes in shapes}
H10W72/07353 (Changes in shapes) appears on 1,056 US grants and 1,195 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,056
- Published applications
- 1,195
- Assignees
- 347
- Inventors
- 2,415
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 6 | 0 |
| 1997 | 8 | 0 |
| 1998 | 13 | 0 |
| 1999 | 10 | 0 |
| 2000 | 17 | 0 |
| 2001 | 24 | 12 |
| 2002 | 25 | 36 |
| 2003 | 21 | 25 |
| 2004 | 28 | 33 |
| 2005 | 23 | 19 |
| 2006 | 25 | 31 |
| 2007 | 23 | 45 |
| 2008 | 18 | 32 |
| 2009 | 14 | 36 |
| 2010 | 46 | 43 |
| 2011 | 28 | 49 |
| 2012 | 28 | 35 |
| 2013 | 53 | 24 |
| 2014 | 48 | 49 |
| 2015 | 36 | 43 |
| 2016 | 30 | 47 |
| 2017 | 51 | 40 |
| 2018 | 30 | 43 |
| 2019 | 37 | 41 |
| 2020 | 47 | 98 |
| 2021 | 50 | 85 |
| 2022 | 65 | 84 |
| 2023 | 64 | 74 |
| 2024 | 63 | 68 |
| 2025 | 55 | 64 |
| 2026 | 46 | 39 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Patterned sheet MUF for complex packages and methods of producing6 Oct 2026US 12,757,781 B2Intel Corporation
- Anchor-containing underfill structures for a chip package and methods of forming the same29 Sep 2026US 12,751,304 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic devices and methods of manufacturing electronic devices22 Sep 2026US 12,745,629 B2Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor package with reduced adhesive fillets22 Sep 2026US 12,745,680 B2Samsung Electronics Co., Ltd.
- Package structure and method for manufacturing the same25 Aug 2026US 12,721,198 B2Nanya Technology Corporation
- Semiconductor structure and methods of manufacturing the same1 Oct 2026US 2026/0305394 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package1 Oct 2026US 2026/0305477 A1Samsung Electronics Co., Ltd.
- Method of fabricating semiconductor package17 Sep 2026US 2026/0282924 A1Samsung Electronics Co., Ltd.
- Semiconductor package17 Sep 2026US 2026/0282983 A1Samsung Electronics Co., Ltd.
- Package structure and method of forming the same17 Sep 2026US 2026/0283013 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Fabrication process of semiconductor package and semiconductor package390US 5,976,912 AHitachi Chemical Company, Ltd. · 1999
- Leadframe for use in manufacturing a resin-molded semiconductor device295US 6,208,020 B1Matsushita Electronics Corporation · 2001
- Pad array semiconductor device264US 5,592,025 AMotorola, Inc. · 1997
- Resin-sealed semiconductor device, circuit member used therefor245US 6,201,292 B1Dai Nippon Insatsu Kabushiki Kaisha · 2001
- Method and structure for wafer to wafer bonding in semiconductor packaging237US 8,377,798 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013