H10W 72/07352
Changes in structures or sizes
Official title: {changes in structures or sizes}
H10W72/07352 (Changes in structures or sizes) appears on 1,725 US grants and 1,860 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,725
- Published applications
- 1,860
- Assignees
- 516
- Inventors
- 3,528
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 7 | 0 |
| 1993 | 12 | 0 |
| 1994 | 14 | 0 |
| 1995 | 10 | 0 |
| 1996 | 10 | 0 |
| 1997 | 13 | 0 |
| 1998 | 25 | 0 |
| 1999 | 28 | 0 |
| 2000 | 39 | 0 |
| 2001 | 56 | 38 |
| 2002 | 48 | 70 |
| 2003 | 55 | 59 |
| 2004 | 62 | 74 |
| 2005 | 49 | 68 |
| 2006 | 45 | 61 |
| 2007 | 48 | 66 |
| 2008 | 44 | 62 |
| 2009 | 38 | 63 |
| 2010 | 53 | 52 |
| 2011 | 45 | 64 |
| 2012 | 62 | 61 |
| 2013 | 53 | 42 |
| 2014 | 47 | 59 |
| 2015 | 52 | 72 |
| 2016 | 53 | 77 |
| 2017 | 73 | 69 |
| 2018 | 60 | 81 |
| 2019 | 71 | 82 |
| 2020 | 80 | 140 |
| 2021 | 75 | 120 |
| 2022 | 105 | 116 |
| 2023 | 82 | 92 |
| 2024 | 79 | 89 |
| 2025 | 77 | 50 |
| 2026 | 40 | 33 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Patterned sheet MUF for complex packages and methods of producing6 Oct 2026US 12,757,781 B2Intel Corporation
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Semiconductor device having chip capacitor connected to semiconductor chip with wires8 Sep 2026US 12,733,183 B2Renesas Electronics Corporation
- Redistribution layer metallic layout structure and method with warpage reduction8 Sep 2026US 12,733,435 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure and method for manufacturing the same25 Aug 2026US 12,721,198 B2Nanya Technology Corporation
- Redistribution layer metallic layout structure and method with warpage reduction1 Oct 2026US 2026/0305234 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and manufacturing method therefor17 Sep 2026US 2026/0282945 A1Kabushiki Kaisha Toshiba
- Semiconductor package17 Sep 2026US 2026/0283036 A1Samsung Electronics Co., Ltd.
- Semiconductor memory and manufacturing method thereof27 Aug 2026US 2026/0256025 A1Kioxia Corporation
- Insulation structure for electrical isolation6 Aug 2026US 2026/0231785 A1Texas Instruments Incorporated
Most cited
By later US patents
- Light emitting diodes including modifications for light extraction390US 6,791,119 B2Cree, Inc. · 2004
- Pad array semiconductor device with thermal conductor and process for making the same386US 5,285,352 AMotorola, Inc. · 1994
- Wafer level stack structure for system-in-package and method thereof377US 7,215,033 B2Samsung Electronics Co., Ltd. · 2007
- Multichip module having a stacked chip arrangement358US 5,323,060 AMicron Semiconductor, Inc. · 1994
- Ball grid assembly type semiconductor device having a heat diffusion function and an electric and magnetic shielding function310US 5,640,047 AMitsui High-Tec, Inc. · 1997