Light emitting diodes including modifications for light extraction

A light emitting diode comprising:

• a substrate having first and second opposing faces, the first face having smaller surface area than the second face;
• a diode region on the second face;
• a first layer comprising silver and/or aluminum on the first face opposite the diode region;
• a second layer comprising titanium on the first layer opposite the substrate;
• a third layer comprising platinum on the second layer opposite the first layer;
• a fourth layer comprising gold on the third layer opposite the second layer;
• a fifth layer comprising nickel/gold, nickel oxide/gold, nickel oxide/platinum, titanium and/or titanium/gold on the diode region opposite the substrate;
• a sixth layer comprising silver and/or aluminum on the fifth layer, opposite the diode region;
• a seventh layer comprising nickel, nickel/vanadium and/or titanium/tungsten on the sixth layer opposite the fifth layer;
• and
• a eighth layer comprising gold, indium, solder and/or braze on the seventh layer opposite the sixth layer.

A light emitting diode comprising:

• a substrate having first and second opposing faces, the first face having smaller surface area than the second face;
• a diode region on the second face;
• a first adhesion layer on the first face opposite the diode region;
• a first barrier layer on the first adhesion layer opposite the substrate;
• a first bonding layer on the first barrier layer opposite the first adhesion layer;
• an ohmic layer on the diode region opposite the substrate;
• a reflector layer on the ohmic layer opposite the diode region;
• a second adhesion layer on the reflector layer opposite the ohmic layer;
• a second barrier layer on the second adhesion layer opposite the reflector layer;
• and
• a second bonding layer on the second barrier layer opposite the second adhesion layer.

A light emitting diode comprising;

• a substrate having first and second opposing faces, the first face having smaller surface area than the second face;
• a diode region on the second face;
• a first layer comprising titanium on the first face opposite the diode region;
• a second layer comprising platinum on the first layer opposite the substrate;
• a third layer comprising gold on the second layer opposite the first layer;
• a fourth layer comprising nickel/gold, nickel oxide/gold, nickel oxide/platinum, titanium and/or titanium/gold on the diode region opposite the substrate;
• a fifth layer comprising silver and/or aluminum on the fourth layer opposite the diode region;
• a sixth layer comprising titanium on the fifth layer opposite the fourth layer;
• a seventh layer comprising platinum on the sixth layer opposite the fifth layer;
• and
• an eighth layer comprising gold on the seventh layer opposite the sixth layer.