Semiconductor package

A method for manufacturing a semiconductor package comprising:

• forming a semiconductor wafer including a plurality of first semiconductor chips divided by a scribe lane;
• forming a recess portion extending between the plurality of first semiconductor chips along the scribe lane;
• cutting the semiconductor wafer along the scribe lane so that the plurality of first semiconductor chips are separated from each other, wherein each of the plurality of first semiconductor chips has a recess surface including a horizontal surface and a vertical surface;
• and bonding one of the plurality of first semiconductor chips onto a top of a stack of second semiconductor chips with an adhesive film interposed therebetween, wherein the adhesive film comprises:
• a central portion filling a space between a lower surface of the one of the plurality of first semiconductor chips and the top of the stack of second semiconductor chips, and an edge portion filling a space between the horizontal surface of the one of the plurality of first semiconductor chips and the top of the stack of second semiconductor chips, and wherein the edge portion overlaps only the lower surface of the one of the plurality of first semiconductor chips in a horizontal direction.

A method for manufacturing a semiconductor package comprising:

• forming a semiconductor wafer including a plurality of first semiconductor chips divided by a scribe lane;
• forming a recess portion between the plurality of first semiconductor chips along the scribe lane;
• cutting the semiconductor wafer along the scribe lane so that the plurality of first semiconductor chips are separated from each other, wherein each of the plurality of first semiconductor chips has a central portion and the recess portion surrounding the central portion;
• and bonding one of the plurality of first semiconductor chips onto a top of a plurality of second semiconductor chips with a first adhesive film interposed therebetween, wherein the plurality of second semiconductor chips are stacked with a second adhesive film interposed between adjacent ones of the plurality of second semiconductor chips, wherein the first adhesive film comprises:
• a first central part overlapping the central portion of the one of the plurality of first semiconductor chips in a vertical direction, and an edge part extending from the first central part and overlapping the recess portion of the one of the plurality of first semiconductor chips in the vertical direction, wherein the second adhesive film comprises:
• a second central part overlapping at least one of the plurality of second semiconductor chips in the vertical direction, and an extension part extending from the second central part and protruding from an outermost side of the plurality of second semiconductor chips in a horizontal direction, wherein, in the horizontal direction, a first width of the first central part is greater than a second width of the second central part.