H10W 72/07235
Applying em radiation
Official title: {Applying EM radiation, e.g. induction heating or using a laser}
H10W72/07235 (Applying em radiation) appears on 407 US grants and 478 published applications in this corpus.
Search patents in H10W- Granted patents
- 407
- Published applications
- 478
- Assignees
- 155
- Inventors
- 791
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 0 |
| 2002 | 4 | 2 |
| 2003 | 2 | 3 |
| 2004 | 5 | 5 |
| 2005 | 4 | 8 |
| 2006 | 1 | 8 |
| 2007 | 7 | 14 |
| 2008 | 4 | 6 |
| 2009 | 7 | 16 |
| 2010 | 15 | 5 |
| 2011 | 8 | 7 |
| 2012 | 11 | 10 |
| 2013 | 13 | 12 |
| 2014 | 6 | 8 |
| 2015 | 13 | 21 |
| 2016 | 10 | 17 |
| 2017 | 19 | 23 |
| 2018 | 22 | 33 |
| 2019 | 28 | 31 |
| 2020 | 31 | 52 |
| 2021 | 25 | 38 |
| 2022 | 47 | 44 |
| 2023 | 31 | 28 |
| 2024 | 38 | 39 |
| 2025 | 24 | 26 |
| 2026 | 12 | 22 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bonding head and bonding apparatus6 Oct 2026US 12,752,380 B2Pac Tech—Packaging Technologies GmbH
- Wire bonding using in-situ plasma treatment and apparatus for effecting the same6 Oct 2026US 12,757,746 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Sintered metal flip chip joints18 Aug 2026US 12,713,938 B2Texas Instruments Incorporated
- Lasing to attach die to lead frame18 Aug 2026US 12,713,963 B2Texas Instruments Incorporated
- Soldering device including pulsed light irradiator, soldering method using pulsed light irradiation, and method of manufacturing semiconductor package11 Aug 2026US 12,703,044 B2Samsung Electronics Co., Ltd.
- Semiconductor Device and Method of Making Using Dual-Laser Compression Bonding17 Sep 2026US 2026/0282989 A1JCET STATS ChipPAC Korea Limited
- Microwave-reactive micro-heater, method for device transfer and bonding using the same, and apparatus therefor13 Aug 2026US 2026/0239499 A1Electronics and Telecommunications Research Institute
- Semiconductor devices and methods of manufacturing semiconductor devices13 Aug 2026US 2026/0240033 A1Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor chip laser bonding device23 Jul 2026US 2026/0215315 A1Viatron Technologies Inc.
- Device for holding a substrate and a method and apparatus for forming an electronic module9 Jul 2026US 2026/0198359 A1JCET STATS ChipPAC Korea Limited
Most cited
By later US patents
- 3D IC method and device388US 7,485,968 B2Ziptronix, Inc. · 2009
- Semiconductor integrated circuit chip-to-chip interconnection scheme256US 4,937,653 AAmerican Telephone and Telegraph Company · 1990
- Hybrid bonding with uniform pattern density252US 9,299,736 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- 3D IC method and device251US 9,171,756 B2Ziptronix, Inc. · 2015
- Method for fabricating semiconductor components with through wire interconnects153US 7,371,676 B2Micron Technology, Inc. · 2008