H10W 72/01935
By plating
Official title: {by plating, e.g. electroless plating or electroplating}
H10W72/01935 (By plating) appears on 2,049 US grants and 2,450 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,049
- Published applications
- 2,450
- Assignees
- 395
- Inventors
- 3,275
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 1 | 3 |
| 2003 | 3 | 4 |
| 2004 | 3 | 3 |
| 2005 | 4 | 8 |
| 2006 | 4 | 6 |
| 2007 | 2 | 6 |
| 2008 | 0 | 14 |
| 2009 | 3 | 15 |
| 2010 | 14 | 31 |
| 2011 | 22 | 65 |
| 2012 | 45 | 152 |
| 2013 | 85 | 132 |
| 2014 | 123 | 159 |
| 2015 | 148 | 200 |
| 2016 | 168 | 161 |
| 2017 | 200 | 183 |
| 2018 | 177 | 155 |
| 2019 | 142 | 159 |
| 2020 | 163 | 211 |
| 2021 | 167 | 218 |
| 2022 | 165 | 159 |
| 2023 | 131 | 113 |
| 2024 | 127 | 123 |
| 2025 | 93 | 116 |
| 2026 | 56 | 53 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Molded thin semiconductor die packages and related methods22 Sep 2026US 12,745,662 B2Semiconductor Components Industries, LLC
- Substrate and method of manufacturing the same22 Sep 2026US 12,745,665 B2Samsung Electro-Mechanics Co., Ltd.
- Integrated device comprising stacked inductors with low or no mutual inductance15 Sep 2026US 12,740,406 B2QUALCOMM Incorporated
- Package structure having a semiconductor functional structure and redistribution layers (RDLs)8 Sep 2026US 12,733,459 B2Changxin Memory Technologies, Inc.
- Semiconductor die package and methods of manufacturing8 Oct 2026US 2026/0314505 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure and fabrication method thereof1 Oct 2026US 2026/0305439 A1United Microelectronics Corp.
- Multi-layer metal stack for wire bonding1 Oct 2026US 2026/0305453 A1
- Method of making semiconductor device having a redistribution line17 Sep 2026US 2026/0282994 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and method of manufacturing the same17 Sep 2026US 2026/0282998 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Methods for hybrid wafer bonding271US 8,802,538 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Hybrid bonding mechanisms for semiconductor wafers261US 9,142,517 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Bonding structure for stacked semiconductor devices254US 9,230,941 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Conductive barrier direct hybrid bonding254US 9,953,941 B2Invensas Bonding Technologies, Inc. · 2018
- Wafer-to-wafer bonding structure251US 9,941,243 B2Samsung Electronics Co., Ltd. · 2018