H10W 70/468
Circuit boards
Official title: {Circuit boards}
H10W70/468 (Circuit boards) appears on 853 US grants and 941 published applications in this corpus.
Search patents in H10W- Granted patents
- 853
- Published applications
- 941
- Assignees
- 269
- Inventors
- 1,596
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 5 | 0 |
| 1991 | 2 | 0 |
| 1992 | 10 | 0 |
| 1993 | 11 | 0 |
| 1994 | 16 | 0 |
| 1995 | 17 | 0 |
| 1996 | 15 | 0 |
| 1997 | 8 | 0 |
| 1998 | 11 | 0 |
| 1999 | 11 | 0 |
| 2000 | 13 | 0 |
| 2001 | 14 | 8 |
| 2002 | 13 | 5 |
| 2003 | 7 | 10 |
| 2004 | 11 | 18 |
| 2005 | 9 | 18 |
| 2006 | 11 | 19 |
| 2007 | 18 | 20 |
| 2008 | 10 | 37 |
| 2009 | 16 | 29 |
| 2010 | 24 | 26 |
| 2011 | 30 | 30 |
| 2012 | 26 | 19 |
| 2013 | 23 | 25 |
| 2014 | 28 | 39 |
| 2015 | 30 | 39 |
| 2016 | 30 | 32 |
| 2017 | 34 | 35 |
| 2018 | 29 | 33 |
| 2019 | 31 | 40 |
| 2020 | 33 | 68 |
| 2021 | 49 | 72 |
| 2022 | 61 | 82 |
| 2023 | 55 | 68 |
| 2024 | 60 | 86 |
| 2025 | 50 | 53 |
| 2026 | 27 | 30 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device and power converter22 Sep 2026US 12,745,654 B2Mitsubishi Electric Corporation
- Semiconductor device25 Aug 2026US 12,721,163 B2Denso Corporation
- QFN package comprising two electronic chips with different substrates18 Aug 2026US 12,713,944 B2STMicroelectroncis (Grenoble 2) SAS
- Semiconductor device having metal member with bonding member receiving space11 Aug 2026US 12,707,970 B2Denso Corporation
- Package with molding cavity11 Aug 2026US 12,708,024 B2Semiconductor Components Industries, LLC
- Power device package1 Oct 2026US 2026/0305466 A1GaNrich Semiconductor Corporation
- Power module package with molded via and dual side press-fit pin27 Aug 2026US 2026/0255983 A1Semiconductor Components Industries, LLC
- Packaged device, method for manufacturing, and lead frame27 Aug 2026US 2026/0255985 A1NXP USA, Inc.
- Connection board for flash memory chip and preparation method therefor, and flash memory chip27 Aug 2026US 2026/0256032 A1Gigadevice Semiconductor (Xian) Inc.
- Semiconductor module20 Aug 2026US 2026/0247995 A1Fuji Electric Co., Ltd.
Most cited
By later US patents
- Stacked multi-chip modules and method of manufacturing346US 5,422,435 ANational Semiconductor Corporation · 1995
- Molded circuit package having heat dissipating post312US 5,172,213 AAT&T Bell Laboratories · 1992
- Integrated circuit package having an interposer263US 5,332,864 AVLSI Technology, Inc. · 1994
- Integrated circuit package with bonding planes on a ceramic ring using an adhesive assembly253US 6,285,075 B1ASAT Ltd. · 2001
- Stacked multi-chip modules and method of manufacturing252US 5,495,398 ANational Semiconductor Corporation · 1996