QFN package comprising two electronic chips with different substrates

A package, comprising:

• a leadframe having a die pad part configured to dissipate heat, a first set of leads part, and a second set of leads part configured to transmit and/or receive electrical signals;
• a first electronic chip having a first semiconductor substrate;
• a second electronic chip having a second semiconductor substrate;
• wherein the first and second semiconductor substrates are different;
• a laminated interconnection support having a mounting face and an attaching face opposite to the mounting face;
• a cladding encapsulating the first and second electronic chips and the laminated interconnection support;
• wherein the first electronic chip is mounted to the die pad part of the leadframe, electrically coupled to the second electronic chip by connecting wires, and electrically coupled to the second set of leads part of the leadframe by connecting wires;
• and
• wherein the second electronic chip is mounted to the mounting face of the laminated interconnection support, with the attaching face of the laminated interconnection support mounted to the die pad part of the leadframe through a first array of connection balls, and with the attaching face of the laminated interconnection support electrically coupled to the first set of leads part of the leadframe by said a first array of connection balls.