Semiconductor module

A semiconductor module comprising:

• one lead frame;
• a plurality of leads;
• a plurality of semiconductor chips arranged on the lead frame;
• and
• an insulating substrate arranged on the lead frame and including a wiring layer, wherein
• the plurality of semiconductor chips includes at least a first semiconductor chip and a second semiconductor chip,
• the first semiconductor chip and the second semiconductor chip each include a first main electrode and a second main electrode provided on their first and second main surfaces, respectively,
• a first main surface of the insulating substrate faces the lead frame, and a second main surface of the insulating substrate includes the wiring layer provided thereon,
• the first main electrode of the first semiconductor chip is electrically connected to the lead frame via a first conductive material,
• the first main electrode of the second semiconductor chip is electrically connected to the wiring layer of the insulating substrate via a second conductive material, and
• a first wiring electrically connecting the second main electrode of the first semiconductor chip and a first lead of the plurality of leads to each other is provided.