Power module package with molded via and dual side press-fit pin
AssigneeSemiconductor Components Industries, LLC
InventorsHeejo CHI, Seungwon IM, Oseob JEON
Life of this patent
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Abstract
A module includes an assembly of a semiconductor device die coupled to a lead frame. A board is disposed below the lead frame. The board includes a plated-through hole (PTH) aligned with an opening in the lead frame above the board. The module further includes a mold body encapsulating at least a portion of the assembly. The mold body includes a through-mold via (TMV) aligned with the opening in the lead frame and with the PTH. The PTH is physically accessible from outside the mold body through the TMV and the opening in the lead frame.
Claims20
A module comprising:
- an assembly including:
- a semiconductor device die disposed on a substrate;
- a lead frame including an opening, the lead frame being electrically coupled to the semiconductor device die;
- and
- a press-fit pin coupler aligned with the opening and disposed, at least in part, below the lead frame, the press-fit pin coupler being configured to receive a pin;
- and
- a mold body encapsulating at least a portion of the assembly, the mold body including a through-mold via (TMV) aligned with the opening the lead frame and with the press-fit pin coupler, the press-fit pin coupler being physically accessible from outside the mold body through the TMV and the opening in the lead frame.
A module comprising:
- a power device disposed on a first substrate encapsulated in a mold body;
- a lead frame attached to a second substrate encapsulated in the mold body, the lead frame including an opening;
- and
- a press-fit pin coupler aligned with the opening, the press-fit pin coupler including a receptacle extending below the lead frame and configured to receive a pin, the mold body including a through-mold via (TMV) aligned with the opening the lead frame and with the press-fit pin coupler, the press-fit pin coupler being physically accessible from outside the mold body through the TMV and the opening in the lead frame.
A method comprising:
- forming an assembly including a semiconductor device die disposed on a substrate, a lead frame including an opening, the lead frame being electrically coupled to the semiconductor device die, and a press-fit pin coupler disposed below at least a portion of the lead frame and aligned with the opening, the press-fit pin coupler being configured to receive a pin;
- and
- encapsulating at least a portion of the assembly in a mold body, the mold body including a through-mold via (TMV) aligned with the opening the lead frame and with the press-fit pin coupler, the press-fit pin coupler being physically accessible from outside the mold body through the TMV and the opening in the lead frame.
Dependencies are inferred from the claim text.