Semiconductor device having metal member with bonding member receiving space

A semiconductor device comprising:

• a semiconductor element having main electrodes disposed on opposite faces in a plate thickness direction;
• a substrate having an insulating base member, a front-face metal body disposed on a front face of the insulating base member and electrically connected to one of the main electrodes of the semiconductor element, and a back-face metal body disposed on a back face of the insulating base member;
• a bonding member;
• and
• a metal member connected to the front-face metal body through the bonding member, wherein
• the metal member has an opposing face opposing an upper face of the front-face metal body and a receiving portion disposed adjacent to the opposing face to provide a receiving space to receive the bonding member therein,
• the bonding member is received in the receiving space in a state where the opposing face is in contact with the upper face of the front-face metal body,
• the receiving portion defines an opening on a side face of the metal member, and
• the opposing face includes a first opposing portion that is disposed opposite to the opening with respect to the receiving portion, and a second opposing portion that is adjacent to the receiving portion in a direction orthogonal to an arrangement direction of the receiving portion and the first opposing portion and the plate thickness direction.

A semiconductor device comprising:

• a semiconductor element having main electrodes disposed on opposite faces in a plate thickness direction;
• a substrate having an insulating base member, a front-face metal body disposed on a front face of the insulating base member and electrically connected to one of the main electrodes of the semiconductor element, and a back-face metal body disposed on a back face of the insulating base member;
• a bonding member;
• and
• a metal member connected to the front-face metal body through the bonding member, wherein
• the metal member has an opposing face opposing an upper face of the front-face metal body and a receiving portion disposed adjacent to the opposing face to provide a receiving space to receive the bonding member therein,
• the bonding member is received in the receiving space in a state where the opposing face is in contact with the upper face of the front-face metal body,
• the front-face metal body includes a base material, a metal film disposed on a face of the base material, and an uneven oxide film made of an oxide of a same metal as a metal of the metal film as a main component and having a continuous uneven surface, and
• the uneven oxide film is not disposed in a first region overlapping the receiving portion in the front-face metal body but is disposed in a second region overlapping the opposing face and/or a peripheral region on a periphery of the second region.