H10W 20/4424
Copper alloys
Official title: {Copper alloys}
H10W20/4424 (Copper alloys) appears on 587 US grants and 544 published applications in this corpus.
Search patents in H10W- Granted patents
- 587
- Published applications
- 544
- Assignees
- 149
- Inventors
- 996
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 5 | 0 |
| 1995 | 7 | 0 |
| 1996 | 4 | 0 |
| 1997 | 5 | 0 |
| 1998 | 7 | 0 |
| 1999 | 9 | 0 |
| 2000 | 24 | 0 |
| 2001 | 32 | 8 |
| 2002 | 32 | 35 |
| 2003 | 11 | 8 |
| 2004 | 13 | 16 |
| 2005 | 9 | 13 |
| 2006 | 8 | 9 |
| 2007 | 4 | 9 |
| 2008 | 4 | 8 |
| 2009 | 8 | 12 |
| 2010 | 14 | 16 |
| 2011 | 12 | 12 |
| 2012 | 8 | 7 |
| 2013 | 4 | 9 |
| 2014 | 23 | 45 |
| 2015 | 29 | 45 |
| 2016 | 36 | 34 |
| 2017 | 47 | 32 |
| 2018 | 42 | 38 |
| 2019 | 36 | 42 |
| 2020 | 31 | 37 |
| 2021 | 28 | 21 |
| 2022 | 20 | 22 |
| 2023 | 20 | 20 |
| 2024 | 16 | 16 |
| 2025 | 15 | 16 |
| 2026 | 12 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor structure and manufacturing method thereof29 Sep 2026US 12,751,258 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method to improve interconnect coefficient of thermal expansion14 Jul 2026US 12,685,108 B2APPLIED Materials.Inc.
- Package comprising a substrate with post interconnects and a solder resist layer having a cavity23 Jun 2026US 12,667,029 B2QUALCOMM Incorporated
- Interconnect structure16 Jun 2026US 12,660,593 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit device26 May 2026US 12,642,076 B2Samsung Electronics Co., Ltd.
- Method to improve interconnect coefficient of thermal expansion8 Oct 2026US 2026/0314357 A1APPLIED Materials.Inc.
- Package structure and method for manufacturing the same1 Oct 2026US 2026/0305312 A1National Yang Ming.Chiao Tung University
- Semiconductor device and preparation method therefor, and memory and electronic device17 Sep 2026US 2026/0282342 A1Beijing Superstring Academy of Memory Technology
- Semiconductor structure and manufacturing method thereof13 Aug 2026US 2026/0239942 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Interconnect structure including vertical conductors and method for manufacturing the same30 Jul 2026US 2026/0223664 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Plated copper interconnect structure621US 5,969,422 AAdvanced Micro Devices, Inc. · 1999
- Method for fabricating copper-aluminum metallization383US 5,913,147 AAdvanced Micro Devices, Inc. · 1999
- Copper damascene technology for ultra large scale integration circuits328US 6,174,812 B1United Microelectronics Corp. · 2001
- Copper alloy electroplating bath for microelectronic applications264US 6,319,387 B1Semitool, Inc. · 2001
- Method and apparatus of forming a sputtered doped seed layer259US 6,432,819 B1APPLIED Materials.Inc. · 2002