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US 2026/0305312 A1Published application
Package structure and method for manufacturing the same
AssigneeNational Yang Ming Chiao Tung University
InventorsChih CHEN, Yu-Wen HUNG
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Abstract
A package structure comprises: a substrate; a first copper conductive element disposed on the substrate and having a first upper surface and two first side surfaces, wherein the two first side surfaces are opposite to each other and connected to the first upper surface respectively; and a first passivation layer formed on the first upper surface and the two first side surface of the first copper conductive element, wherein the first passivation later comprises Cu3Sn.
Claims16
A package structure, comprising:
- a substrate;
- a first copper conductive element disposed on the substrate and having a first upper surface and two first side surfaces, wherein the two first side surfaces are opposite to each other and respectively connected to the first upper surface;
- and
- a first passivation layer formed on the first upper surface and the two first side surfaces of the first copper conductive element, wherein the first passivation layer comprises Cu3Sn.
1 more element
A method for manufacturing a package structure, comprising the following steps:
- providing a substrate, wherein a first copper conductive element is disposed on the substrate and has a first upper surface and two first side surfaces, and the two first side surfaces are opposite to each other and respectively connected to the first upper surface;
- forming a tin layer on the first upper surface and the two first side surfaces of the first copper conductive element;
- and
- performing an annealing process, wherein the tin layer and copper of the first copper conductive element undergo a phase change to form a first passivation layer on the first upper surface and two first side surfaces of the first copper conductive element, and the first passivation layer comprises Cu3Sn.
1 more element
Dependencies are inferred from the claim text.