H10W 20/218
In silicon-on-insulator [soi] wafers
Official title: {in silicon-on-insulator [SOI] wafers}
H10W20/218 (In silicon-on-insulator [soi] wafers) appears on 397 US grants and 412 published applications in this corpus.
Search patents in H10W- Granted patents
- 397
- Published applications
- 412
- Assignees
- 121
- Inventors
- 632
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 1 |
| 2002 | 6 | 7 |
| 2003 | 6 | 4 |
| 2004 | 4 | 5 |
| 2005 | 8 | 13 |
| 2006 | 10 | 12 |
| 2007 | 4 | 10 |
| 2008 | 5 | 13 |
| 2009 | 14 | 15 |
| 2010 | 13 | 17 |
| 2011 | 16 | 17 |
| 2012 | 13 | 20 |
| 2013 | 25 | 22 |
| 2014 | 24 | 17 |
| 2015 | 13 | 20 |
| 2016 | 20 | 23 |
| 2017 | 33 | 35 |
| 2018 | 29 | 42 |
| 2019 | 27 | 23 |
| 2020 | 37 | 26 |
| 2021 | 19 | 11 |
| 2022 | 13 | 20 |
| 2023 | 14 | 19 |
| 2024 | 10 | 9 |
| 2025 | 11 | 5 |
| 2026 | 8 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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Most cited
By later US patents
- Three-dimensional integrated semiconductor devices526US 6,943,067 B2Advanced Micro Devices, Inc. · 2005
- SOI stacked DRAM logic395US 6,544,837 B1International Business Machines Corporation · 2003
- Process of manufacturing a three dimensional integrated circuit from stacked SOI wafers using a temporary silicon substrate288US 5,426,072 AHughes Aircraft Company · 1995
- Semiconductor device277US 8,044,464 B2Semiconductor Energy Laboratory Co.Ltd. · 2011
- Methods of forming wiring to transistor and related transistor262US 7,666,723 B2International Business Machines Corporation · 2010