H10W 20/095
By irradiating with electromagnetic or particle radiation
Official title: {by irradiating with electromagnetic or particle radiation (plasma treatment H10W20/096)}
H10W20/095 (By irradiating with electromagnetic or particle radiation) appears on 918 US grants and 1,042 published applications in this corpus.
Search patents in H10W- Granted patents
- 918
- Published applications
- 1,042
- Assignees
- 183
- Inventors
- 1,771
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 9 | 0 |
| 2000 | 13 | 0 |
| 2001 | 32 | 11 |
| 2002 | 31 | 35 |
| 2003 | 25 | 26 |
| 2004 | 38 | 41 |
| 2005 | 19 | 59 |
| 2006 | 29 | 55 |
| 2007 | 37 | 56 |
| 2008 | 29 | 64 |
| 2009 | 40 | 53 |
| 2010 | 43 | 47 |
| 2011 | 47 | 50 |
| 2012 | 41 | 35 |
| 2013 | 38 | 36 |
| 2014 | 47 | 26 |
| 2015 | 28 | 33 |
| 2016 | 32 | 40 |
| 2017 | 37 | 30 |
| 2018 | 37 | 32 |
| 2019 | 32 | 28 |
| 2020 | 27 | 42 |
| 2021 | 22 | 32 |
| 2022 | 34 | 65 |
| 2023 | 45 | 54 |
| 2024 | 48 | 39 |
| 2025 | 29 | 41 |
| 2026 | 15 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for forming a contact plug with improved contact metal sealing4 Aug 2026US 12,701,977 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Staircase structure in three-dimensional memory device and method for forming the same21 Jul 2026US 12,690,453 B2Yangtze Memory Technologies Co., Ltd.
- Semiconductor device including a self-aligned contact layer with enhanced etch resistance28 Apr 2026US 12,616,011 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Interconnect structures with nitrogen-rich dielectric material interfaces for low resistance vias in integrated circuits21 Apr 2026US 12,610,806 B2Intel Corporation
- Contact interface engineering for reducing contact resistance7 Apr 2026US 12,598,766 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Apparatus and method for repairing defect of semiconductor8 Oct 2026US 2026/0311964 A1Tokyo Electron Limited
- Semiconductor device and methods of formation24 Sep 2026US 2026/0293637 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device including a self-aligned contact layer with enhanced etch resistance30 Jul 2026US 2026/0223656 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Interconnect structure including contact via with increased contact area to metal line and method for manufacturing the same9 Jul 2026US 2026/0198278 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Etch stop layer isolation from metal vias and contacts25 Jun 2026US 2026/0182358 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method for densification of CVD carbon-doped silicon oxide films through UV irradiation581US 6,566,278 B1APPLIED Materials.Inc. · 2003
- UV treatment for carbon-containing low-k dielectric repair in semiconductor processing570US 7,851,232 B2Novellus Systems, Inc. · 2010
- Plasma activated conformal film deposition548US 8,728,956 B2Novellus Systems, Inc. · 2014
- Method for fabricating semiconductor device537US 7,842,518 B2Kabushiki Kaisha Toshiba · 2010
- UV assisted silylation for recovery and pore sealing of damaged low K films528US 8,492,170 B2APPLIED Materials.Inc. · 2013