Semiconductor device and methods of formation

Abstract

A semiconductor chip includes a plurality of exposure regions which are sequentially patterned by different reticles. For example, two or more reticles may be used to respectively pattern different portions of a semiconductor chip, resulting in a semiconductor chip with increased area in comparison to semiconductor chips manufactured with a single reticle. As a result, the semiconductor chip can incorporate various circuit functions that may be needed for high performance computing (HPC) functions without chip size limitations. Accordingly, a single large area semiconductor chip with internal connections between different functional components may be used in place of multiple smaller area semiconductor chips that are spaced apart from each other and externally connected to each other. As a result of the elimination of the external connections and spacing between multiple semiconductor chips, HPC performance may be increased and/or failure risk may be decreased, leading to an increase in device reliability.

Dependencies are inferred from the claim text.