H10P 76/2041
Photolithographic processes
Official title: {Photolithographic processes}
H10P76/2041 (Photolithographic processes) appears on 3,818 US grants and 4,123 published applications in this corpus.
Search patents in H10P- Granted patents
- 3,818
- Published applications
- 4,123
- Assignees
- 614
- Inventors
- 7,144
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 6 | 0 |
| 1982 | 2 | 0 |
| 1983 | 5 | 0 |
| 1984 | 0 | 0 |
| 1985 | 8 | 0 |
| 1986 | 8 | 0 |
| 1987 | 4 | 0 |
| 1988 | 11 | 0 |
| 1989 | 9 | 0 |
| 1990 | 12 | 0 |
| 1991 | 9 | 0 |
| 1992 | 18 | 0 |
| 1993 | 9 | 0 |
| 1994 | 26 | 0 |
| 1995 | 18 | 0 |
| 1996 | 13 | 0 |
| 1997 | 27 | 0 |
| 1998 | 43 | 0 |
| 1999 | 59 | 0 |
| 2000 | 98 | 0 |
| 2001 | 106 | 28 |
| 2002 | 85 | 67 |
| 2003 | 88 | 100 |
| 2004 | 74 | 104 |
| 2005 | 80 | 98 |
| 2006 | 66 | 78 |
| 2007 | 52 | 58 |
| 2008 | 48 | 65 |
| 2009 | 42 | 51 |
| 2010 | 50 | 55 |
| 2011 | 50 | 41 |
| 2012 | 37 | 50 |
| 2013 | 53 | 76 |
| 2014 | 70 | 111 |
| 2015 | 118 | 202 |
| 2016 | 199 | 269 |
| 2017 | 244 | 251 |
| 2018 | 205 | 287 |
| 2019 | 294 | 337 |
| 2020 | 293 | 350 |
| 2021 | 231 | 298 |
| 2022 | 222 | 247 |
| 2023 | 183 | 264 |
| 2024 | 185 | 259 |
| 2025 | 220 | 233 |
| 2026 | 130 | 144 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Apparatus for treating substrate and method for treating a substrate6 Oct 2026US 12,754,475 B2Semes Co., Ltd.
- EUV resist underlayer film-forming composition6 Oct 2026US 12,754,479 B2Nissan Chemical Corporation
- Pattern forming method, semiconductor device manufacturing method, and template6 Oct 2026US 12,754,487 B2Kioxia Corporation
- Encapsulating semiconductor chips using masks6 Oct 2026US 12,757,793 B2Kioxia Corporation
- Thin film transistors and related fabrication techniques29 Sep 2026US 12,751,044 B2Micron Technology, Inc.
- Photosensitive resin composition, cured substance, laminate, manufacturing method for cured substance, manufacturing method for laminate, manufacturing method for semiconductor device, semiconductor device, polyimide, manufacturing method for polyimide, and compound8 Oct 2026US 2026/0310076 A1FUJIFILM Corporation
- Wet removable silicon-containing resist underlayer film-forming composition8 Oct 2026US 2026/0310080 A1Nissan Chemical Corporation
- Resist underlayer film-forming composition8 Oct 2026US 2026/0310081 A1Nissan Chemical Corporation
- Lithography system and methods8 Oct 2026US 2026/0310087 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Photoresist having strengthening material8 Oct 2026US 2026/0314339 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method of spacer patterning to form a target integrated circuit pattern3,272US 9,576,814 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Method for depositing an amorphous carbon layer1,124US 6,573,030 B1APPLIED Materials.Inc. · 2003
- Method for integrated circuit patterning805US 9,184,054 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Semiconductor substrate process using a low temperature deposited carbon-containing hard mask566US 7,323,401 B2APPLIED Materials.Inc. · 2008
- Footing reduction using etch-selective layer523US 8,298,951 B1ASM Japan K .K. · 2012