H10P 76/20
Manufacture or treatment of masks on semiconductor bodies: of masks comprising organic
Official title: of masks comprising organic materials
H10P76/20 (Manufacture or treatment of masks on semiconductor bodies: of masks comprising organic) appears on 6,431 US grants and 6,990 published applications in this corpus.
Search patents in H10P- Granted patents
- 6,431
- Published applications
- 6,990
- Assignees
- 938
- Inventors
- 11,197
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 6 | 0 |
| 1978 | 15 | 0 |
| 1979 | 5 | 0 |
| 1980 | 12 | 0 |
| 1981 | 14 | 0 |
| 1982 | 16 | 0 |
| 1983 | 21 | 0 |
| 1984 | 14 | 0 |
| 1985 | 25 | 0 |
| 1986 | 27 | 0 |
| 1987 | 19 | 0 |
| 1988 | 20 | 0 |
| 1989 | 20 | 0 |
| 1990 | 20 | 0 |
| 1991 | 18 | 0 |
| 1992 | 32 | 0 |
| 1993 | 18 | 0 |
| 1994 | 35 | 0 |
| 1995 | 26 | 0 |
| 1996 | 24 | 0 |
| 1997 | 43 | 0 |
| 1998 | 56 | 0 |
| 1999 | 76 | 0 |
| 2000 | 114 | 0 |
| 2001 | 120 | 36 |
| 2002 | 108 | 95 |
| 2003 | 119 | 138 |
| 2004 | 107 | 170 |
| 2005 | 114 | 164 |
| 2006 | 96 | 133 |
| 2007 | 84 | 123 |
| 2008 | 83 | 151 |
| 2009 | 73 | 143 |
| 2010 | 99 | 164 |
| 2011 | 110 | 109 |
| 2012 | 118 | 128 |
| 2013 | 137 | 159 |
| 2014 | 158 | 229 |
| 2015 | 221 | 362 |
| 2016 | 355 | 476 |
| 2017 | 444 | 483 |
| 2018 | 370 | 471 |
| 2019 | 527 | 598 |
| 2020 | 485 | 570 |
| 2021 | 397 | 457 |
| 2022 | 349 | 356 |
| 2023 | 298 | 377 |
| 2024 | 279 | 358 |
| 2025 | 320 | 334 |
| 2026 | 178 | 206 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Apparatus for treating substrate and method for treating a substrate6 Oct 2026US 12,754,475 B2Semes Co., Ltd.
- EUV resist underlayer film-forming composition6 Oct 2026US 12,754,479 B2Nissan Chemical Corporation
- Pattern forming method, semiconductor device manufacturing method, and template6 Oct 2026US 12,754,487 B2Kioxia Corporation
- Enhancement-mode HEMT and manufacturing process of the same6 Oct 2026US 12,757,427 B2STMicroelectronics S,r.l.
- Encapsulating semiconductor chips using masks6 Oct 2026US 12,757,793 B2Kioxia Corporation
- Photosensitive resin composition, cured substance, laminate, manufacturing method for cured substance, manufacturing method for laminate, manufacturing method for semiconductor device, semiconductor device, polyimide, manufacturing method for polyimide, and compound8 Oct 2026US 2026/0310076 A1FUJIFILM Corporation
- Wet removable silicon-containing resist underlayer film-forming composition8 Oct 2026US 2026/0310080 A1Nissan Chemical Corporation
- Resist underlayer film-forming composition8 Oct 2026US 2026/0310081 A1Nissan Chemical Corporation
- Lithography system and methods8 Oct 2026US 2026/0310087 A1Taiwan Semiconductor Manufacturing Company.Ltd
- System and method for detecting semiconductor processing error8 Oct 2026US 2026/0314334 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method of spacer patterning to form a target integrated circuit pattern3,272US 9,576,814 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Method for depositing an amorphous carbon layer1,124US 6,573,030 B1APPLIED Materials.Inc. · 2003
- Method for reducing, by a factor or 2.sup.-N, the minimum masking pitch of a photolithographic process1,059US 5,328,810 AMicron Technology, Inc. · 1994
- Method for integrated circuit patterning805US 9,184,054 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Semiconductor substrate process using a low temperature deposited carbon-containing hard mask566US 7,323,401 B2APPLIED Materials.Inc. · 2008