Pattern forming method, semiconductor device manufacturing method, and template

A pattern forming method, comprising:

• placing a resin material on a film to be processed;
• pressing a template having a plurality of patterns protruding from a reference plane against the resin material to form a first resin film having first and second patterns, which are separated from each other in a first direction, and a third pattern between the first and second patterns;
• forming a second resin film to cover the first resin film and fill the first, second, and third patterns of the first resin film;
• exposing and developing the second resin film to expose the first and second patterns while leaving the second resin film in the third pattern;
• and
• processing the film to be processed via the first and second resin films to transfer the first and second patterns to the film to be processed without transfer of the third pattern to the film to be processed.