H10P 76/202
For lift-off processes
Official title: {for lift-off processes}
H10P76/202 (For lift-off processes) appears on 437 US grants and 360 published applications in this corpus.
Search patents in H10P- Granted patents
- 437
- Published applications
- 360
- Assignees
- 237
- Inventors
- 1,064
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 4 | 0 |
| 1978 | 6 | 0 |
| 1979 | 2 | 0 |
| 1980 | 5 | 0 |
| 1981 | 5 | 0 |
| 1982 | 6 | 0 |
| 1983 | 12 | 0 |
| 1984 | 8 | 0 |
| 1985 | 14 | 0 |
| 1986 | 14 | 0 |
| 1987 | 11 | 0 |
| 1988 | 4 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 9 | 0 |
| 1993 | 7 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 5 | 0 |
| 1997 | 2 | 0 |
| 1998 | 5 | 0 |
| 1999 | 7 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 3 |
| 2002 | 5 | 3 |
| 2003 | 1 | 11 |
| 2004 | 6 | 10 |
| 2005 | 5 | 10 |
| 2006 | 5 | 10 |
| 2007 | 5 | 7 |
| 2008 | 3 | 10 |
| 2009 | 2 | 12 |
| 2010 | 9 | 11 |
| 2011 | 19 | 1 |
| 2012 | 5 | 9 |
| 2013 | 6 | 11 |
| 2014 | 15 | 18 |
| 2015 | 19 | 28 |
| 2016 | 23 | 12 |
| 2017 | 16 | 20 |
| 2018 | 15 | 26 |
| 2019 | 23 | 30 |
| 2020 | 23 | 18 |
| 2021 | 20 | 25 |
| 2022 | 15 | 19 |
| 2023 | 17 | 18 |
| 2024 | 14 | 23 |
| 2025 | 14 | 8 |
| 2026 | 9 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Enhancement-mode HEMT and manufacturing process of the same6 Oct 2026US 12,757,427 B2STMicroelectronics S,r.l.
- Semiconductor photoresist composition and method of forming patterns using the composition15 Sep 2026US 12,736,878 B2Samsung Electronics Co., Ltd.
- Composition for forming organic film, patterning process, and compound and polymer for forming organic film8 Sep 2026US 12,730,377 B2Shin-Etsu Chemical Co., Ltd.
- Air bridge structure and manufacturing method thereof, and superconducting quantum chip and manufacturing method thereof11 Aug 2026US 12,707,962 B2Suzhou Institute of Nano-Tech and Nano-Bionics (Sinano) , Chinese Academy of Sciences
- Mandrel-pull-first interconnect patterning5 May 2026US 12,622,246 B2International Business Machines Corporation
- Method for forming patterned mask on substrate8 Oct 2026US 2026/0314340 A1Tokyo Electron Limited
- Method for manufacturing semiconductor structure using multi-layered hard mask10 Sep 2026US 2026/0271679 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for manufacturing semiconductor device and semiconductor device11 Jun 2026US 2026/0165192 A1Mitsubishi Electric Corporation
- Semiconductor structure and production method thereof14 May 2026US 2026/0136899 A1AAC Technologies PTE.Ltd.
- Method of manufacturing semiconductor device including two-dimensional materials23 Apr 2026US 2026/0113964 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Method for integrated circuit patterning805US 9,184,054 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Method for lifting off photoresist beneath an overlayer147US 8,357,244 B1Western Digital (Fremont), LLC · 2013
- Composite back-etch/lift-off stencil for proximity effect minimization133US 4,560,435 AInternational Business Machines Corporation · 1985
- Method for forming dense multilevel interconnection metallurgy for semiconductor devices128US 4,423,547 AInternational Business Machines Corporation · 1984
- Method for forming a conductive layer117US 6,924,230 B2Industrial Technology Research Institute · 2005