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US 6,924,230 B2Granted
Method for forming a conductive layer
AssigneeIndustrial Technology Research Institute
InventorsYu-Chang Sun, Ching-Hsuan Tang, Chi-Shen Lee, Chai-Yuan Sheu
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Abstract
A method for forming a conductive layer is disclosed, which has the following steps. First, a substrate is provided, and then a patterned photoresist layer having an undercut is formed on the substrate. After that, at least one conductive layer is deposited on the substrate. Finally, the patterned photoresist layer is lifted off; wherein the shape of the conductive layer remaining on the substrate is complementary to that of the patterned photoresist layer.
Claims1
A method for forming a conductive layer comprising:
- (A) providing a substrate;
- (B) forming a patterned single-layered photoresist having an undercut on said substrate;
- (C) depositing at least one conductive layer on said substrate;
- and
- (D) lifting off said patterned photoresist layer;
- wherein the remained conductive layer takes the shape of the lifted photoresist layer accordingly;
- wherein an edge of said conductive layer forms a taper, which is less than 60° and is defined by the surfaces of said conductive layer and said substrate.
4 more elements
Dependencies are inferred from the claim text.