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US 12,622,246 B2Granted
Mandrel-pull-first interconnect patterning
AssigneeInternational Business Machines Corporation
InventorsXiaoming Yang, Yann Mignot, Somnath Ghosh, Daniel Charles Edelstein
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Abstract
A semiconductor structure includes a substrate; a spacer protruding from the substrate and surrounding a cavity; and spin-on glass filling a portion of the cavity.
Claims13
A semiconductor structure comprising:
- a substrate;
- a spacer protruding from the substrate and surrounding a cavity;
- and
- spin-on glass filling a portion of the cavity where, in the portion of the cavity filled with the spin-on glass, the spin-on glass directly contacts the spacer.
1 more element
Dependencies are inferred from the claim text.