Semiconductor structure and production method thereof
AssigneeAAC Technologies Pte. Ltd.
InventorsChungmin Li, KianHeng Goh, Qiang Dan, Kahkeen Lai
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AssigneeAAC Technologies Pte. Ltd.
InventorsChungmin Li, KianHeng Goh, Qiang Dan, Kahkeen Lai
Estimating the term…
Embodiments of the present disclosure relate to the field of semiconductor technology, and provide a semiconductor structure and a production method thereof. The method for producing semiconductor structures includes: providing a substrate; forming an initial photoresist layer on the substrate, and patterning the initial photoresist layer to form a photoresist layer, where a plurality of positioning openings passing through the photoresist layer are defined on the photoresist layer; forming an initial target layer on a surface of the photoresist layer away from the substrate, where the initial target layer fills in the plurality of positioning openings; removing portions of the initial target layer protruding from the surface of the photoresist layer away from the substrate, where portions of the initial target layer filling in the plurality of positioning openings form a target layer; and removing the photoresist layer.
A method for producing semiconductor structures, comprising:
A semiconductor structure, produced using a method for producing semiconductor structures, wherein the method comprises:
Dependencies are inferred from the claim text.