H10P 76/2042
Using lasers
Official title: {using lasers}
H10P76/2042 (Using lasers) appears on 229 US grants and 317 published applications in this corpus.
Search patents in H10P- Granted patents
- 229
- Published applications
- 317
- Assignees
- 93
- Inventors
- 687
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 7 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 1 |
| 2002 | 4 | 2 |
| 2003 | 2 | 4 |
| 2004 | 1 | 6 |
| 2005 | 3 | 7 |
| 2006 | 7 | 4 |
| 2007 | 2 | 2 |
| 2008 | 4 | 6 |
| 2009 | 4 | 4 |
| 2010 | 1 | 2 |
| 2011 | 3 | 0 |
| 2012 | 0 | 2 |
| 2013 | 6 | 5 |
| 2014 | 2 | 7 |
| 2015 | 8 | 6 |
| 2016 | 8 | 11 |
| 2017 | 12 | 12 |
| 2018 | 5 | 13 |
| 2019 | 10 | 16 |
| 2020 | 17 | 30 |
| 2021 | 18 | 24 |
| 2022 | 16 | 22 |
| 2023 | 13 | 44 |
| 2024 | 19 | 31 |
| 2025 | 14 | 36 |
| 2026 | 22 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- EUV resist underlayer film-forming composition6 Oct 2026US 12,754,479 B2Nissan Chemical Corporation
- Underlayer compound for photolithography, multilayered structure formed using the same, and method for manufacturing semiconductor devices using the same1 Sep 2026US 12,724,346 B2Inha University Research and Business Foundation
- Shared contact structure and methods for forming the same1 Sep 2026US 12,727,457 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Alkaline developer soluable silicon-containing resist underlayer film-forming composition25 Aug 2026US 12,717,235 B2Nissan Chemical Corporation
- Brush polymer, photoresist composition including the same, and method of manufacturing integrated circuit device21 Jul 2026US 12,687,781 B2Samsung Electronics Co., Ltd.
- Photonic communication platform24 Sep 2026US 2026/0287815 A1Lightmatter, Inc.
- Photoresist composition and method for manufacturing semiconductor device using the same24 Sep 2026US 2026/0288005 A1Samsung Electronics Co., Ltd.
- Photosensitive resin composition, cured substance, laminate, manufacturing method for cured substance, manufacturing method for laminate, manufacturing method for semiconductor device, and semiconductor device27 Aug 2026US 2026/0251975 A9FUJIFILM Corporation
- Photoresist top coating material for etching rate control30 Jul 2026US 2026/0219578 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Chemical-resistant protective film9 Jul 2026US 2026/0193459 A1Nissan Chemical Corporation
Most cited
By later US patents
- Process for fabricating small geometry semiconductive devices including integrated components165US 4,049,944 AHughes Aircraft Company · 1977
- Method of forming a resist pattern by using a silicon carbide anti-reflective layer68US 5,591,566 ASony Corporation · 1997
- Manufacture of integrated circuits using holographic techniques63US 4,857,425 AHoltronic Technologies Ltd. · 1989
- Method of forming a resist pattern by using an anti-reflective layer61US 5,472,829 ASony Corporation · 1995
- Interface texturing for light-emitting device56US 6,410,348 B1United Epitaxxy Company, Ltd. · 2002