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US 2026/0193459 A1Published application
Chemical-resistant protective film
AssigneeNissan Chemical Corporation
InventorsTokio NISHITA, Kazuhiko KINOSHITA
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Abstract
A composition for forming a protective film against a wet etching solution for a semiconductor, the composition containing: a compound or polymer having a reactive group capable of undergoing a crosslinking reaction in the presence of a curing agent; a curing agent; a compound having a hydroxy group and at least one of a hydroxy group and a carbonyl group; and a solvent.
Claims30
A composition for forming a protective film against a wet etching solution for a semiconductor, the composition comprising:
- (A) a compound or polymer having a reactive group capable of undergoing a crosslinking reaction in the presence of a curing agent;
- (B) a curing agent;
- (C) a compound having a hydroxy group and at least one of a hydroxy group and a carbonyl group;
- and
- (D) a solvent.
2 more elements
A composition for forming a resist underlayer film, the composition comprising:
- (A) a compound or polymer having a reactive group capable of undergoing a crosslinking reaction in the presence of a curing agent;
- (B) a curing agent;
- (C) a compound having a hydroxy group and at least one of a hydroxy group and a carbonyl group;
- and
- (D) a solvent.
2 more elements
Dependencies are inferred from the claim text.