Footing reduction using etch-selective layer
AssigneeASM Japan K.K.
InventorRyu Nakano
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Abstract
A method of forming side spacers upwardly extending from a substrate, includes: providing a template constituted by a photoresist formed on and in contact with an etch-selective layer laminated on a substrate; anisotropically etching the template in a thickness direction with an oxygen-containing plasma to remove a footing of the photoresist and an exposed portion of the underlying layer; depositing a spacer film on the template by atomic layer deposition (ALD); and forming side spacers using the spacer film by etching. The etch-selective layer has a substantially lower etch rate than that of the photoresist.
Claims11
A method of forming side spacers upwardly extending from a substrate, comprising:
- providing a template constituted by a photoresist formed on and in contact with an etch-selective layer laminated on a substrate, said photoresist having footing at a base of the photoresist, said etch-selective layer having a substantially lower etch rate than that of the photoresist;
- anisotropically etching the template in a thickness direction with an oxygen-containing plasma to remove the footing of the photoresist and an exposed portion of the underlying layer;
- depositing a spacer film on the template by atomic layer deposition (ALD);
- and
- forming side spacers using the spacer film by etching.
Dependencies are inferred from the claim text.