H10P 72/0456
In-line arrangement
Official title: {in-line arrangement}
H10P72/0456 (In-line arrangement) appears on 984 US grants and 1,271 published applications in this corpus.
Search patents in H10P- Granted patents
- 984
- Published applications
- 1,271
- Assignees
- 310
- Inventors
- 2,538
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 4 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 4 | 0 |
| 1992 | 2 | 0 |
| 1993 | 9 | 0 |
| 1994 | 8 | 0 |
| 1995 | 7 | 0 |
| 1996 | 6 | 0 |
| 1997 | 13 | 0 |
| 1998 | 20 | 0 |
| 1999 | 18 | 0 |
| 2000 | 23 | 0 |
| 2001 | 27 | 18 |
| 2002 | 15 | 39 |
| 2003 | 25 | 29 |
| 2004 | 18 | 40 |
| 2005 | 31 | 45 |
| 2006 | 24 | 61 |
| 2007 | 20 | 36 |
| 2008 | 15 | 40 |
| 2009 | 19 | 45 |
| 2010 | 22 | 24 |
| 2011 | 31 | 60 |
| 2012 | 31 | 94 |
| 2013 | 29 | 42 |
| 2014 | 31 | 29 |
| 2015 | 41 | 44 |
| 2016 | 41 | 39 |
| 2017 | 27 | 44 |
| 2018 | 33 | 62 |
| 2019 | 46 | 76 |
| 2020 | 43 | 74 |
| 2021 | 59 | 50 |
| 2022 | 47 | 69 |
| 2023 | 37 | 60 |
| 2024 | 40 | 56 |
| 2025 | 63 | 55 |
| 2026 | 40 | 40 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus for treating substrate22 Sep 2026US 12,745,587 B2Semes Co., Ltd.
- Apparatus of cleaning substrate, apparatus of semiconductor device and method for manufacturing a semiconductor package using the same8 Sep 2026US 12,733,427 B2Samsung Electronics Co., Ltd.
- Method for arranging a semiconductor processing tool on a pedestal25 Aug 2026US 12,721,092 B2Lam Research Corporation
- Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium11 Aug 2026US 12,707,918 B2Kokusai Electric Corporation
- Substrate processing apparatus4 Aug 2026US 12,701,947 B2Ebara Corporation
- Multiple-chamber semiconductor serial constructing apparatus24 Sep 2026US 2026/0293583 A1Advanced Ion Beam Technology, Inc.
- Substrate processing apparatus and substrate processing method24 Sep 2026US 2026/0293584 A1SCREEN Holdings Co., Ltd.
- Cmp device and wafer transfer method3 Sep 2026US 2026/0262468 A1Hangzhou Sizone Electronic Technology Inc.
- Controlled Environment Photoresist Processing System and Method20 Aug 2026US 2026/0244113 A1
- Etching method and etching apparatus13 Aug 2026US 2026/0239904 A1Tokyo Electron Limited
Most cited
By later US patents
- Assembly line processing method586US 7,153,542 B2Tegal Corporation · 2006
- Fabrication of semiconductor interconnect structures553US 7,172,497 B2ASM Nutool, Inc. · 2007
- Perimeter partition-valve with protected seals and associated small size process chambers and multiple chamber systems529US 7,682,454 B2Sundew Technologies, LLC · 2010
- Multi-chamber system having compact installation set-up for an etching facility for semiconductor device manufacturing495US 6,503,365 B1Samsung Electronics Co., Ltd. · 2003
- Substrate processing system494US 5,826,129 ATokyo Electron Kyushu Limited · 1998