H10P 72/0452
Characterised by the layout of the process chambers
Official title: {characterised by the layout of the process chambers}
H10P72/0452 (Characterised by the layout of the process chambers) appears on 2,763 US grants and 3,516 published applications in this corpus.
Search patents in H10P- Granted patents
- 2,763
- Published applications
- 3,516
- Assignees
- 514
- Inventors
- 5,877
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 5 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 6 | 0 |
| 1991 | 9 | 0 |
| 1992 | 5 | 0 |
| 1993 | 15 | 0 |
| 1994 | 20 | 0 |
| 1995 | 15 | 0 |
| 1996 | 21 | 0 |
| 1997 | 27 | 0 |
| 1998 | 32 | 0 |
| 1999 | 42 | 0 |
| 2000 | 60 | 0 |
| 2001 | 79 | 71 |
| 2002 | 83 | 103 |
| 2003 | 77 | 82 |
| 2004 | 59 | 93 |
| 2005 | 71 | 94 |
| 2006 | 53 | 117 |
| 2007 | 45 | 96 |
| 2008 | 46 | 135 |
| 2009 | 41 | 90 |
| 2010 | 55 | 67 |
| 2011 | 73 | 105 |
| 2012 | 69 | 130 |
| 2013 | 59 | 80 |
| 2014 | 72 | 82 |
| 2015 | 81 | 90 |
| 2016 | 84 | 90 |
| 2017 | 66 | 115 |
| 2018 | 86 | 182 |
| 2019 | 112 | 196 |
| 2020 | 137 | 253 |
| 2021 | 188 | 229 |
| 2022 | 175 | 258 |
| 2023 | 186 | 279 |
| 2024 | 180 | 194 |
| 2025 | 192 | 158 |
| 2026 | 121 | 127 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Storage and transfer module and substrate treatment apparatus including storage and transfer module29 Sep 2026US 12,748,355 B2Semes Co., Ltd.
- Container, container partition plate, substrate processing system, and substrate transfer method29 Sep 2026US 12,751,241 B2Tokyo Electron Limited
- Apparatus for treating substrate22 Sep 2026US 12,745,587 B2Semes Co., Ltd.
- Apparatus of cleaning substrate, apparatus of semiconductor device and method for manufacturing a semiconductor package using the same8 Sep 2026US 12,733,427 B2Samsung Electronics Co., Ltd.
- Substrate processing system and maintenance method8 Sep 2026US 12,733,432 B2Tokyo Electron Limited
- Substrate Processing System and Substrate Transfer Method8 Oct 2026US 2026/0310186 A1Tokyo Electron Limited
- Semiconductor Thermal Processing Apparatus and Method for Transferring Workpieces by Carrier Device Thereof8 Oct 2026US 2026/0314307 A1Beijing Naura Microelectronics Equipment Co., Ltd.
- Apparatus for processing substrate and method of transferring substrate8 Oct 2026US 2026/0314331 A1Tokyo Electron Limited
- Method to improve interconnect coefficient of thermal expansion8 Oct 2026US 2026/0314357 A1APPLIED Materials.Inc.
- Processing apparatus for substrate1 Oct 2026US 2026/0297749 A1Nexusbe Co., Ltd
Most cited
By later US patents
- Multi-chamber integrated process system988US 4,951,601 AAPPLIED Materials.Inc. · 1990
- Ultra high throughput wafer vacuum processing system973US 5,855,681 AAPPLIED Materials.Inc. · 1999
- Staged-vacuum wafer processing system and method701US 5,186,718 AAPPLIED Materials.Inc. · 1993
- Wafer processing cluster tool batch preheating and degassing apparatus663US 5,259,881 AMaterials Research Corporation · 1993
- Systems and methods for robotic transfer of workpieces between a storage area and a processing chamber658US 6,315,512 B1Mattson Technology, Inc. · 2001