Processing apparatus for substrate

Abstract

The present disclosure relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus for processing a substrate in a state in which the substrate is disposed in a reaction chamber. According to one aspect of an example embodiment of the present disclosure, a substrate processing apparatus includes a chamber assembly in which two sub-chamber units are disposed, a showerhead unit disposed in each of the two sub-chamber units and having a plurality of gas through-holes formed therein, a susceptor disposed in each of the two sub-chamber units, on an upper surface of which a substrate is seated, and a blocking portion configured to partition the chamber assembly to form at least two buffer regions that stabilize an internal pressure of the chamber assembly, the at least two buffer regions being regions between the two sub-chamber units and a region having one of the two sub-chamber units interposed therebetween, in which pressure is controlled between the at least two buffer regions and internal regions of the two sub-chamber units in accordance with an elevating position of the susceptor.

Dependencies are inferred from the claim text.