H10P 72/0454
Surrounding a central transfer chamber
Official title: {surrounding a central transfer chamber}
H10P72/0454 (Surrounding a central transfer chamber) appears on 1,143 US grants and 1,427 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,143
- Published applications
- 1,427
- Assignees
- 206
- Inventors
- 2,772
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 11 | 0 |
| 1995 | 7 | 0 |
| 1996 | 11 | 0 |
| 1997 | 13 | 0 |
| 1998 | 13 | 0 |
| 1999 | 18 | 0 |
| 2000 | 28 | 0 |
| 2001 | 37 | 48 |
| 2002 | 51 | 53 |
| 2003 | 38 | 44 |
| 2004 | 36 | 51 |
| 2005 | 44 | 47 |
| 2006 | 27 | 35 |
| 2007 | 18 | 23 |
| 2008 | 19 | 25 |
| 2009 | 12 | 23 |
| 2010 | 17 | 18 |
| 2011 | 17 | 26 |
| 2012 | 16 | 20 |
| 2013 | 11 | 14 |
| 2014 | 12 | 18 |
| 2015 | 14 | 14 |
| 2016 | 21 | 30 |
| 2017 | 19 | 52 |
| 2018 | 37 | 77 |
| 2019 | 45 | 82 |
| 2020 | 57 | 119 |
| 2021 | 79 | 103 |
| 2022 | 81 | 136 |
| 2023 | 96 | 150 |
| 2024 | 94 | 90 |
| 2025 | 74 | 73 |
| 2026 | 59 | 56 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Container, container partition plate, substrate processing system, and substrate transfer method29 Sep 2026US 12,751,241 B2Tokyo Electron Limited
- Substrate processing system and maintenance method8 Sep 2026US 12,733,432 B2Tokyo Electron Limited
- Substrate processing system and substrate transfer method8 Sep 2026US 12,733,437 B2Tokyo Electron Limited
- Substrate processing system and particle removal method1 Sep 2026US 12,725,769 B2Tokyo Electron Limited
- In-situ wafer stress measurement by chromatic confocal sensor scanning with temperature compensation25 Aug 2026US 12,716,713 B2Orbotech Ltd.
- Substrate Processing System and Substrate Transfer Method8 Oct 2026US 2026/0310186 A1Tokyo Electron Limited
- Apparatus for processing substrate and method of transferring substrate8 Oct 2026US 2026/0314331 A1Tokyo Electron Limited
- Batch substrate processing for area selective deposition1 Oct 2026US 2026/0305230 A1ASM IP Holding B. V.
- Heater plate with different emissivity for temperature uniformity17 Sep 2026US 2026/0282805 A1ASM IP Holding B. V.
- Substrate processing method10 Sep 2026US 2026/0271644 A1Tokyo Electron Limited
Most cited
By later US patents
- Multi-chamber integrated process system988US 4,951,601 AAPPLIED Materials.Inc. · 1990
- Ultra high throughput wafer vacuum processing system973US 5,855,681 AAPPLIED Materials.Inc. · 1999
- Staged-vacuum wafer processing system and method701US 5,186,718 AAPPLIED Materials.Inc. · 1993
- Wafer processing cluster tool batch preheating and degassing apparatus663US 5,259,881 AMaterials Research Corporation · 1993
- Method and apparatus for scheduling wafer processing within a multiple chamber semiconductor wafer processing tool having a multiple blade robot619US 6,074,443 AAPPLIED Materials.Inc. · 2000