H10P 72/0431
Apparatus for thermal treatment
Official title: {Apparatus for thermal treatment}
H10P72/0431 (Apparatus for thermal treatment) appears on 8,390 US grants and 10,823 published applications in this corpus.
Search patents in H10P- Granted patents
- 8,390
- Published applications
- 10,823
- Assignees
- 1,420
- Inventors
- 15,000
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 7 | 0 |
| 1985 | 6 | 0 |
| 1986 | 5 | 0 |
| 1987 | 9 | 0 |
| 1988 | 15 | 0 |
| 1989 | 26 | 0 |
| 1990 | 26 | 0 |
| 1991 | 23 | 0 |
| 1992 | 34 | 0 |
| 1993 | 50 | 0 |
| 1994 | 55 | 0 |
| 1995 | 44 | 0 |
| 1996 | 59 | 0 |
| 1997 | 47 | 0 |
| 1998 | 81 | 0 |
| 1999 | 122 | 0 |
| 2000 | 141 | 0 |
| 2001 | 193 | 85 |
| 2002 | 191 | 223 |
| 2003 | 170 | 222 |
| 2004 | 177 | 300 |
| 2005 | 175 | 286 |
| 2006 | 161 | 280 |
| 2007 | 129 | 256 |
| 2008 | 119 | 328 |
| 2009 | 118 | 294 |
| 2010 | 165 | 283 |
| 2011 | 199 | 266 |
| 2012 | 206 | 300 |
| 2013 | 200 | 329 |
| 2014 | 235 | 367 |
| 2015 | 263 | 407 |
| 2016 | 287 | 412 |
| 2017 | 351 | 462 |
| 2018 | 343 | 539 |
| 2019 | 422 | 665 |
| 2020 | 497 | 744 |
| 2021 | 501 | 696 |
| 2022 | 530 | 765 |
| 2023 | 499 | 750 |
| 2024 | 543 | 596 |
| 2025 | 607 | 629 |
| 2026 | 346 | 339 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Plasma processing device and plasma processing method6 Oct 2026US 12,757,669 B2Hitachi High-Tech Corporation
- Thermal treatment apparatus, thermal treatment method, and storage medium6 Oct 2026US 12,757,670 B2Tokyo Electron Limited
- Heating/cooling device and heating/cooling method6 Oct 2026US 12,757,671 B2Tokyo Electron Limited
- Substrate treating apparatus and substrate treating method6 Oct 2026US 12,757,672 B2Semes Co., Ltd.
- Rapid and precise temperature control for thermal etching6 Oct 2026US 12,757,675 B2Lam Research Corporation
- Method for fabricating a semiconductor device using heat treatment apparatus8 Oct 2026US 2026/0314299 A1Samsung Electronics Co., Ltd.
- Semiconductor Thermal Processing Apparatus and Method for Transferring Workpieces by Carrier Device Thereof8 Oct 2026US 2026/0314307 A1Beijing Naura Microelectronics Equipment Co., Ltd.
- Filament for heater pedestal8 Oct 2026US 2026/0314332 A1Lam Research Corporation
- Liner for batch semiconductor processing apparatus1 Oct 2026US 2026/0297733 A1ASM IP Holding B. V.
- Multiple-chamber reactor for selective deposition of silicon nitride and method of using same1 Oct 2026US 2026/0297752 A1ASM IP Holding B. V.
Most cited
By later US patents
- High temperature multi-layered alloy heater assembly and related methods858US 6,035,101 AAPPLIED Materials.Inc. · 2000
- Conductor treating single-wafer type treating device and method for semi-conductor treating734US 7,235,137 B2Tokyo Electron Limited · 2007
- Substrate platform for a semiconductor substrate during rapid high temperature processing and method of supporting a substrate678US 6,090,212 AMicro C Technologies, Inc. · 2000
- Wafer support system670US 6,053,982 AASM America, Inc. · 2000
- Multi-zone resistance heater664US 6,740,853 B1Tokyo Electron Limited · 2004