H10P 72/0434
Mainly by convection
Official title: {mainly by convection}
H10P72/0434 (Mainly by convection) appears on 3,969 US grants and 5,378 published applications in this corpus.
Search patents in H10P- Granted patents
- 3,969
- Published applications
- 5,378
- Assignees
- 757
- Inventors
- 8,392
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 6 | 0 |
| 1988 | 7 | 0 |
| 1989 | 5 | 0 |
| 1990 | 6 | 0 |
| 1991 | 7 | 0 |
| 1992 | 7 | 0 |
| 1993 | 16 | 0 |
| 1994 | 11 | 0 |
| 1995 | 16 | 0 |
| 1996 | 19 | 0 |
| 1997 | 23 | 0 |
| 1998 | 37 | 0 |
| 1999 | 44 | 0 |
| 2000 | 48 | 0 |
| 2001 | 87 | 39 |
| 2002 | 94 | 114 |
| 2003 | 76 | 95 |
| 2004 | 97 | 176 |
| 2005 | 87 | 137 |
| 2006 | 83 | 159 |
| 2007 | 65 | 138 |
| 2008 | 63 | 170 |
| 2009 | 55 | 150 |
| 2010 | 81 | 158 |
| 2011 | 109 | 153 |
| 2012 | 116 | 185 |
| 2013 | 100 | 164 |
| 2014 | 115 | 162 |
| 2015 | 139 | 198 |
| 2016 | 142 | 202 |
| 2017 | 157 | 202 |
| 2018 | 157 | 279 |
| 2019 | 198 | 355 |
| 2020 | 245 | 376 |
| 2021 | 248 | 319 |
| 2022 | 280 | 321 |
| 2023 | 248 | 372 |
| 2024 | 236 | 291 |
| 2025 | 286 | 325 |
| 2026 | 143 | 138 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Temperature control system with flammable heat transfer fluid29 Sep 2026US 12,751,236 B2APPLIED Materials.Inc.
- Modularized bonding apparatus22 Sep 2026US 12,745,584 B2Hanwha Precision Machinery Co., Ltd.
- Substrate processing method and substrate processing apparatus22 Sep 2026US 12,745,586 B2Ebara Corporation
- Information processing system, power adjustment method, and heat treatment apparatus22 Sep 2026US 12,745,589 B2Tokyo Electron Limited
- Deposition system and method1 Sep 2026US 12,727,404 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Liner for batch semiconductor processing apparatus1 Oct 2026US 2026/0297733 A1ASM IP Holding B. V.
- Substrate processing apparatus and substrate processing method1 Oct 2026US 2026/0305224 A1Shibaura Mechatronics Corporation
- Substrate processing apparatus1 Oct 2026US 2026/0305229 A1SCREEN Holdings Co., Ltd.
- Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device and non-transitory computer-readable recording medium24 Sep 2026US 2026/0293589 A1Kokusai Electric Corporation
- Method and system for thermal control of devices in an electronics tester17 Sep 2026US 2026/0276734 A1Aehr Test Systems
Most cited
By later US patents
- High temperature multi-layered alloy heater assembly and related methods858US 6,035,101 AAPPLIED Materials.Inc. · 2000
- Conductor treating single-wafer type treating device and method for semi-conductor treating734US 7,235,137 B2Tokyo Electron Limited · 2007
- Wafer support system670US 6,053,982 AASM America, Inc. · 2000
- Multi-zone resistance heater664US 6,740,853 B1Tokyo Electron Limited · 2004
- High throughput multi station processor for multiple single wafers657US 4,987,856 AAdvanced Semiconductor Materials America, Inc. · 1991