Substrate processing apparatus and substrate processing method
AssigneeShibaura Mechatronics Corporation
InventorsKeisuke TSUSHIMA, Takahiro KANAI
Life of this patent
Estimating the term…
Loading patent…
AssigneeShibaura Mechatronics Corporation
InventorsKeisuke TSUSHIMA, Takahiro KANAI
Estimating the term…
A substrate processing apparatus according to an embodiment includes a rotary holding portion including a holding portion for holding a substrate and a rotary body having an upper surface facing a bottom surface of the substrate held by the holding portion, the rotary holding portion rotating the substrate by rotating the holding portion and the rotary body, a first gas supply portion for supplying a first gas for cooling into a space between the upper surface of the rotary body and the substrate held by the holding portion, a first liquid supply portion for supplying a first liquid to the substrate held by the holding portion, and a second liquid supply portion for supplying a second liquid having a temperature of 0° C. or higher to the upper surface of the rotary body.
A substrate processing apparatus comprising:
A substrate processing method comprising:
Dependencies are inferred from the claim text.