H10P 72/0432
Mainly by conduction
Official title: {mainly by conduction}
H10P72/0432 (Mainly by conduction) appears on 2,648 US grants and 3,660 published applications in this corpus.
Search patents in H10P- Granted patents
- 2,648
- Published applications
- 3,660
- Assignees
- 536
- Inventors
- 5,845
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 3 | 0 |
| 1987 | 0 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 6 | 0 |
| 1991 | 5 | 0 |
| 1992 | 15 | 0 |
| 1993 | 11 | 0 |
| 1994 | 15 | 0 |
| 1995 | 10 | 0 |
| 1996 | 15 | 0 |
| 1997 | 17 | 0 |
| 1998 | 18 | 0 |
| 1999 | 28 | 0 |
| 2000 | 36 | 0 |
| 2001 | 39 | 23 |
| 2002 | 48 | 71 |
| 2003 | 55 | 77 |
| 2004 | 36 | 77 |
| 2005 | 59 | 80 |
| 2006 | 27 | 72 |
| 2007 | 35 | 53 |
| 2008 | 31 | 70 |
| 2009 | 27 | 66 |
| 2010 | 34 | 53 |
| 2011 | 40 | 34 |
| 2012 | 35 | 41 |
| 2013 | 39 | 66 |
| 2014 | 41 | 73 |
| 2015 | 52 | 81 |
| 2016 | 53 | 100 |
| 2017 | 76 | 157 |
| 2018 | 83 | 179 |
| 2019 | 145 | 248 |
| 2020 | 150 | 294 |
| 2021 | 193 | 339 |
| 2022 | 210 | 389 |
| 2023 | 226 | 368 |
| 2024 | 256 | 250 |
| 2025 | 319 | 282 |
| 2026 | 144 | 117 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Thermal treatment apparatus, thermal treatment method, and storage medium6 Oct 2026US 12,757,670 B2Tokyo Electron Limited
- Apparatus for treating substrate22 Sep 2026US 12,745,587 B2Semes Co., Ltd.
- Wafer holder device having heating function15 Sep 2026US 12,740,365 B2Sky Tech Inc.
- Metal-on-metal deposition methods for filling a gap feature on a substrate surface8 Sep 2026US 12,729,430 B2ASM IP Holding B. V.
- Plug, method of manufacturing plug, and member for semiconductor manufacturing apparatus8 Sep 2026US 12,733,429 B2NGK Insulators, Ltd.
- Filament for heater pedestal8 Oct 2026US 2026/0314332 A1Lam Research Corporation
- Method and system for thermal control of devices in an electronics tester17 Sep 2026US 2026/0276734 A1Aehr Test Systems
- Integral resistance heaters including niobium and processes for making same17 Sep 2026US 2026/0282171 A1Materion Corporation
- Batch processing apparatus, systems, and related methods and structures for epitaxial deposition operations17 Sep 2026US 2026/0282793 A1APPLIED Materials.Inc.
- Batch processing apparatus, systems, and related methods and structures for epitaxial deposition operations17 Sep 2026US 2026/0282794 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Multi-zone resistance heater664US 6,740,853 B1Tokyo Electron Limited · 2004
- Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support659US 6,847,014 B1Lam Research Corporation · 2005
- High throughput multi station processor for multiple single wafers657US 4,987,856 AAdvanced Semiconductor Materials America, Inc. · 1991
- Combination bake/chill apparatus incorporating low thermal mass, thermally conductive bakeplate610US 6,072,163 AFSI International, Inc. · 2000
- Closed-loop dome thermal control apparatus for a semiconductor wafer processing system593US 6,367,410 B1APPLIED Materials.Inc. · 2002